The semiconductor is getting exciting again as reflected by the record attendance at this year’s Hot Chips Conference at Stanford University. And much of this excitement is driven by artificial intelligence and machine learning (AI/ML). Join TIRIAS Research principal analysts Kevin Krewell (@krewell) and Jim McGregor (@tekstrategist) as review the presentations and announcements from the 2019 Hot Chips conference, including the new wafer-scale AI platform from Cerebras, in this TIRIAScast.