Rob Franzo, Committee Chair of the RPA Technology Working Group and Consultant for Qualcomm Technologies, Inc., sits down with Todd Hoff, Executive VP of Member Programs for RPA, to discuss the recent update to the Smarter, Technology-Driven Supply Chain with Reusable Packaging Systems white paper (previously published in 2019), given the considerable acceleration in developing and adopting technologies aimed at automatic identification, monitoring, and tracking of Reusable Transport Packaging (RTP) assets throughout the supply chain.