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AC Interview - Mobility Innovation w. Bill Foy, SVP Engineering, Denso International
John talks with Bill Foy, SVP for Engineering for Denso, a mobility OEM that is launching a new Seattle Innovation Lab focused on connected vehicles and cloud computing. John and Bill take a look at the Seattle Lab's remit and what new mobility players are trying with edge and cloud computing.
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By The Soundcasting Network
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John talks with Bill Foy, SVP for Engineering for Denso, a mobility OEM that is launching a new Seattle Innovation Lab focused on connected vehicles and cloud computing. John and Bill take a look at the Seattle Lab's remit and what new mobility players are trying with edge and cloud computing.