When transistor scaling slows, packaging innovation steps up. Learn how 2.5D, 3D ICs, and hybrid bonding are pushing the boundaries of performance for applications like 5G, AI, and beyond.

When transistor scaling slows, packaging innovation steps up. Learn how 2.5D, 3D ICs, and hybrid bonding are pushing the boundaries of performance for applications like 5G, AI, and beyond.

When transistor scaling slows, packaging innovation steps up. Learn how 2.5D, 3D ICs, and hybrid bonding are pushing the boundaries of performance for applications like 5G, AI, and beyond.

Advanced Packaging: Breaking the Limits of Moore’s Law

Hey, fellow science enthusiasts! Welcome to our podcast, where we dive deep into the fascinating world of Materials Science! Join us as we explore groundbreaking discoveries in computing, memory, energy, and environmental applications. We’ll unpack the latest research from top-tier journals and shine a spotlight on the innovations that are shaping our future. Get ready for insightful discussions, expert interviews, and a dash of nerdy fun—because science is best when shared!

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Advanced Packaging: Breaking the Limits of Moore’s Law

Advanced Packaging: Breaking the Limits of Moore’s Law