This episode features a technical conversation about co-packaged optics, the rapid rise of interest in this technology, and why active alignment is a major manufacturing bottleneck in photonics. The discussion, sponsored by Aerotech, focuses on the company’s new PICAlign approach, developed in collaboration with SENKO and Santec, which aims to improve throughput, quality, and efficiency in optical device assembly.

Talking with Host Justine Murphy, Aerotech Business Development Manager Justin Bressi explains how monitoring multiple optical channels at once and searching in all six degrees of freedom can improve alignment outcomes and reduce scrap.

The conversation also touches on the broader data center and semiconductor ecosystem, where demand for faster, more efficient photonic systems is driving new investment and partnerships.