In this episode, we discuss Qualcomm’s groundbreaking Snapdragon AR1+ Gen 1 chip for smart glasses, AMD’s powerful new MI350 series AI chips targeting NVIDIA’s dominance, and TCS’s collaboration with NVIDIA to revolutionize telecom infrastructure. These AI hardware and infrastructure developments highlight the shift toward edge computing, enhanced memory capacity for large language models, and AI-native telecom networks. From Qualcomm’s on-device Llama-3.2 AI to AMD’s 22.1 TB/s bandwidth chips and TCS’s digital twin strategies, we explore how the AI stack is being redefined from wearables to data centers.