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On today's episode, we're turning our focus to a pivotal innovation that has transformed design and manufacturing processes: flexible circuits.
Flexible circuits have emerged as a game-changer in the manufacturing and design of electronic assemblies. With their unique ability to bend, twist, and conform to complex shapes, they offer unparalleled advantages in applications where space is at a premium and reliability is paramount.
We'll also touch on the manufacturing complexities, material considerations, and the critical role that process control plays in ensuring reliability and performance.
My guest today is Joseph Fjelstad. Joe is the founder of Verdant Electronics.
Joseph Fjelstad has been active in electronics manufacturing since 1972 in various roles, including as a chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones.
Some of Joe's innovative devices and novel reliability improving IC packaging structural features are found in nearly every electronic device made today.
He is also an author, co-author or editor of several books on interconnection technology, including Flexible Circuit Technology 4th Edition, the most widely distributed reference book on the topic, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics The SAFE Approach.
In addition, Fjelstad has written hundreds of articles, columns and commentaries for various industry magazines and journals over the last five decades. And today, he's the guest on my show.
Here is a list of Joe’s books:
Chip Scale Packaging for Modern Electronics
Solderless Assembly for Electronics: The SAFE Approach
Joe’s Company:
The post RM 156: An Introduction to Flexible Circuits with Joseph Fjelstad appeared first on Accendo Reliability.
By Fred SchenkelbergOn today's episode, we're turning our focus to a pivotal innovation that has transformed design and manufacturing processes: flexible circuits.
Flexible circuits have emerged as a game-changer in the manufacturing and design of electronic assemblies. With their unique ability to bend, twist, and conform to complex shapes, they offer unparalleled advantages in applications where space is at a premium and reliability is paramount.
We'll also touch on the manufacturing complexities, material considerations, and the critical role that process control plays in ensuring reliability and performance.
My guest today is Joseph Fjelstad. Joe is the founder of Verdant Electronics.
Joseph Fjelstad has been active in electronics manufacturing since 1972 in various roles, including as a chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones.
Some of Joe's innovative devices and novel reliability improving IC packaging structural features are found in nearly every electronic device made today.
He is also an author, co-author or editor of several books on interconnection technology, including Flexible Circuit Technology 4th Edition, the most widely distributed reference book on the topic, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics The SAFE Approach.
In addition, Fjelstad has written hundreds of articles, columns and commentaries for various industry magazines and journals over the last five decades. And today, he's the guest on my show.
Here is a list of Joe’s books:
Chip Scale Packaging for Modern Electronics
Solderless Assembly for Electronics: The SAFE Approach
Joe’s Company:
The post RM 156: An Introduction to Flexible Circuits with Joseph Fjelstad appeared first on Accendo Reliability.