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Broadcom Unveils Groundbreaking AI Chip Technology to Revolutionize Performance
Broadcom Inc. has introduced its 3.5D eXtended Die-Stacking in Package (3.5D XDSiP) technology, which promises significant enhancements in semiconductor performance to meet the growing demand for AI infrastructure. This innovation, supported by advanced manufacturing processes from TSMC, is set to improve memory capacity, data transfer rates, and power efficiency, positioning Broadcom as a key player in the competitive AI chip market.
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By Dr. Tony HoangBroadcom Inc. has introduced its 3.5D eXtended Die-Stacking in Package (3.5D XDSiP) technology, which promises significant enhancements in semiconductor performance to meet the growing demand for AI infrastructure. This innovation, supported by advanced manufacturing processes from TSMC, is set to improve memory capacity, data transfer rates, and power efficiency, positioning Broadcom as a key player in the competitive AI chip market.