Tech Behind Fintech

Embedded Lending Revolution: How Agentic Platforms Are Transforming Credit


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Join us on Friday, October 24th, 2025, at 12 PM EST for an in-depth conversation on Tech Behind FinTech featuring Jon Fry, CEO and Founder of Lendflow, a leading embedded finance infrastructure company empowering fintechs, lenders, and vertical SaaS platforms to build and launch credit products faster and smarter. In Embedded Lending Revolution: How Agentic Platforms Are Transforming Credit, Jon unpacks how AI, automation, and agentic systems are reshaping credit delivery for small and medium-sized businesses. From modular lending tools to AI-driven underwriting, Lendflow’s work reveals how the next wave of credit infrastructure is enabling instant decision-making, smarter risk assessment, and democratized access to capital. Jon’s journey from building loan origination firms to creating one of fintech’s most powerful embedded credit platforms reflects the evolution of finance itself — from static systems to adaptive, intelligent ecosystems. Whether you’re a founder, lender, or fintech builder, this episode will help you understand how AI and agentic platforms are not just improving lending — they’re redefining it.

What You’ll Learn:
  • How embedded lending is changing the credit landscape for SMBs
  • The role of agentic AI in transforming underwriting and credit decisioning
  • Why fintechs and vertical SaaS companies are turning to embedded infrastructure over traditional marketplaces
  • The limitations of legacy credit systems — and how modular tools solve them
  • The future of credit infrastructure and AI’s impact on access to capital
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Tech Behind FintechBy Nnamdi Osuagwu