Parker and Stephen discuss the fact that physical limitations of shrinking process nodes are leading to new advancements in silicon interposers and enabling 2.5D packaging architectures, which is making 3D packaging possible, plus an exploration of what ChatGPT is and isn’t capable of, in terms of it answering our questions and whether or not it matters that it can’t draw upon its own experiences to relate to us, like say, wanting to have a beer sometimes. Plus, much more!

Relevant links:

• Why 3D packaging could be the next breakthrough for processing
• Circuit Break Podcast #118: Battlestar Galactic Grounds
• Circuit Break Podcast #17: System-in-Package (SiP) Platforms with Greg Sheridan
• How is ChatGPT biased? Researchers identify a variety of concerns 
• MEP EP#365: Let’s Segway into the Next Topic
• Join the Circuit Break Discourse Community!

Thank you for listening to the MacroFab Engineering Podcast!  We’d love to hear what you think of the show so please tweet at us @MacroFab and join our Circuit Break Community for discussions or email us at [email protected].