When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. 

Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connections. From 3D chip stacking that packs more performance and memory bandwidth into the same footprint to co-packaged optics that bring higher bandwidth directly onto the processor, Sauder reveals how chip packaging has evolved from a simple protective housing to the key driver of next-generation computing. 

In this episode of Manufacturing Matters, Sauder sits down with TECH B2B Marketing's Aaron Hand and Dan McCarthy to explore the manufacturing challenges of connecting chips and chiplets, cooling 4-kilowatt modules, and why the packaging for today’s processors has become as critical than the silicon inside them. 

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