This week in Chips Weekly by Diana :

• 🇺🇸 The U.S. expands its export blacklist with a new “50% rule,” instantly pulling hundreds of China-linked subsidiaries into restrictions.
• 🤝 Siemens & TSMC team up on advanced 3D IC and AI design, reshaping the future of multi-die chips and packaging.
• 🇨🇳 China fires back with anti-dumping probes and fresh import controls aimed at U.S. semiconductor suppliers.
• 🔍 Industry Spotlight: The battle over chiplet standards — why whoever controls the rules for modular chips will control the future of compute.
• 💡 Chip of the Week: TSMC’s SoIC-X 3D packaging platform powering the next generation of AI and HPC.

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