<p>Join Eric in his discussion with Patrick Connally, Technology Architect at Teledyne LeCroy, where they discuss the future of high speed serial links and the challenges of keeping eyes open in the next-generation systems.</p>

Join Eric in his discussion with Patrick Connally, Technology Architect at Teledyne LeCroy, where they discuss the future of high speed serial links and the challenges of keeping eyes open in the next-generation systems.

High Speed Serial Links and Their Challenges

This podcast series is hosted by SIJ Technical Editor, Eric Bogatin and includes fireside chats with members from the Signal Integrity Journal community who are experts in their field and have a commitment to providing training and education in SI, PI, and EMC/EMI issues for other engineers. Podcast sponsored by: Rohde & Schwarz.

Technology

This podcast series is hosted by SIJ Technical Editor, Eric Bogatin and includes fireside chats with members from the Signal Integrity Journal community who are experts in their field and have a commitment to providing training and education in SI, PI, and EMC/EMI issues for other engineers. Podcast sponsored by: Rohde &amp; Schwarz.

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High Speed Serial Links and Their Challenges

High Speed Serial Links and Their Challenges

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