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December 17, 2011IBM and 3M Will Develop Adhesives for Building Powerful Multilayer Chips3 minutesPlayIBM and 3M have announced plans to jointly design adhesives that could enable the stacking of 100 chips, thereby enabling ultrafast processors....moreShareView all episodesBy IEEE Computer Society2.522 ratingsDecember 17, 2011IBM and 3M Will Develop Adhesives for Building Powerful Multilayer Chips3 minutesPlayIBM and 3M have announced plans to jointly design adhesives that could enable the stacking of 100 chips, thereby enabling ultrafast processors....moreMore shows like Computing Now's News PodcastView allUp First from NPR55,983 Listeners
IBM and 3M have announced plans to jointly design adhesives that could enable the stacking of 100 chips, thereby enabling ultrafast processors.
December 17, 2011IBM and 3M Will Develop Adhesives for Building Powerful Multilayer Chips3 minutesPlayIBM and 3M have announced plans to jointly design adhesives that could enable the stacking of 100 chips, thereby enabling ultrafast processors....more
IBM and 3M have announced plans to jointly design adhesives that could enable the stacking of 100 chips, thereby enabling ultrafast processors.