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Indium develop a range of thermal interface materials for power electronics and other applications
Joe Hertline discusses the range of die attach or thermal interface materials to meet increasing range of applications needing higher junction temperatures. Hertline discusses the different materials and how to approach heterogeneous challenges.
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By Global SMT & PackagingJoe Hertline discusses the range of die attach or thermal interface materials to meet increasing range of applications needing higher junction temperatures. Hertline discusses the different materials and how to approach heterogeneous challenges.