The Daily Snapshot - TSMC

Market Insights and Industry Breakthroughs: JEDEC's HBM4 Advancements and Weekly Predictions


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Upcoming Market Forecast and HBM4 Spec Finalization by JEDEC

This week, anticipate market updates and significant advancements as JEDEC nears the finalization of the HBM4 memory specification. The new specs promise up to 32 Gb densities in 16-Hi TSV stacks and speeds of 6.4 Gbps, indicating notable improvements in memory performance and capacity.
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The Daily Snapshot - TSMCBy Spod Media LLC