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June 17, 2021MEP EP#281: Through Hole Manufacturing58 minutesPlayMEP EP#281: Through Hole ManufacturingThrough Hole ManufacturingProcessesHand SolderingSoldering “robot”Wave solderingDesign CriteriaPalletsSelective solderingDesign CriteriaKeepoutsLead FormingPre purchase?Forming with a die?Using hand tools?PCB designHolesNon circular?Annular ringsIPC stuffIPC-2221 Generic Standard on Printed Board DesignIPC-2222 Sectional Design Standard for Rigid Organic Printed BoardsIPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed BoardsIPC-7351 Generic Requirements for Surface Mount Design and Land Pattern StandardPerformance Classification (1,2,3)Producibility Levels (A,B,C)Land Pattern Determination (Density level A,B,C)...moreShareView all episodesBy MacroFab, Inc.4.74040 ratingsJune 17, 2021MEP EP#281: Through Hole Manufacturing58 minutesPlayMEP EP#281: Through Hole ManufacturingThrough Hole ManufacturingProcessesHand SolderingSoldering “robot”Wave solderingDesign CriteriaPalletsSelective solderingDesign CriteriaKeepoutsLead FormingPre purchase?Forming with a die?Using hand tools?PCB designHolesNon circular?Annular ringsIPC stuffIPC-2221 Generic Standard on Printed Board DesignIPC-2222 Sectional Design Standard for Rigid Organic Printed BoardsIPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed BoardsIPC-7351 Generic Requirements for Surface Mount Design and Land Pattern StandardPerformance Classification (1,2,3)Producibility Levels (A,B,C)Land Pattern Determination (Density level A,B,C)...moreMore shows like Circuit Break - A MacroFab PodcastView allHackaday Podcast64 Listeners
MEP EP#281: Through Hole ManufacturingThrough Hole ManufacturingProcessesHand SolderingSoldering “robot”Wave solderingDesign CriteriaPalletsSelective solderingDesign CriteriaKeepoutsLead FormingPre purchase?Forming with a die?Using hand tools?PCB designHolesNon circular?Annular ringsIPC stuffIPC-2221 Generic Standard on Printed Board DesignIPC-2222 Sectional Design Standard for Rigid Organic Printed BoardsIPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed BoardsIPC-7351 Generic Requirements for Surface Mount Design and Land Pattern StandardPerformance Classification (1,2,3)Producibility Levels (A,B,C)Land Pattern Determination (Density level A,B,C)
June 17, 2021MEP EP#281: Through Hole Manufacturing58 minutesPlayMEP EP#281: Through Hole ManufacturingThrough Hole ManufacturingProcessesHand SolderingSoldering “robot”Wave solderingDesign CriteriaPalletsSelective solderingDesign CriteriaKeepoutsLead FormingPre purchase?Forming with a die?Using hand tools?PCB designHolesNon circular?Annular ringsIPC stuffIPC-2221 Generic Standard on Printed Board DesignIPC-2222 Sectional Design Standard for Rigid Organic Printed BoardsIPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed BoardsIPC-7351 Generic Requirements for Surface Mount Design and Land Pattern StandardPerformance Classification (1,2,3)Producibility Levels (A,B,C)Land Pattern Determination (Density level A,B,C)...more
MEP EP#281: Through Hole ManufacturingThrough Hole ManufacturingProcessesHand SolderingSoldering “robot”Wave solderingDesign CriteriaPalletsSelective solderingDesign CriteriaKeepoutsLead FormingPre purchase?Forming with a die?Using hand tools?PCB designHolesNon circular?Annular ringsIPC stuffIPC-2221 Generic Standard on Printed Board DesignIPC-2222 Sectional Design Standard for Rigid Organic Printed BoardsIPC-2223 Sectional Design Standard for Flexible/Rigid-Flexible Printed BoardsIPC-7351 Generic Requirements for Surface Mount Design and Land Pattern StandardPerformance Classification (1,2,3)Producibility Levels (A,B,C)Land Pattern Determination (Density level A,B,C)