From QA Challenges to Innovation with PRIZ

Mystery of the Moving Wafers


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In a discussion about manufacturing inefficiencies, Dr. Thinkman and Debra analyze a persistent quality issue using a real-world scenario involving silicon wafers. They discover that movement during loading misleads temperature readings, causing overheating. Using PRIZ methodology, they identify this overlooked step as the problem. The solution involves disconnecting a thermocouple during transitions.

#manufacturing, #siliconwafers, #qualitycontrol, #PRIZmethodology, #temperaturecontrol, #DrThinkman, #Debra
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From QA Challenges to Innovation with PRIZBy PRIZ Guru