Laser via drilling is a critical process window for MKS's Optimize the Interconnect concepts. Casey Kruger joins the podcast to explain exactly how the CO2 laser technology has been harnessed to create more accurate vias, faster, and in a smaller, more energy-efficient footprint.

MKS' Atotech's Frank Bruening and Roger Massey join us to discuss the emerging complexities in achieving optimal interconnect, and the key role chemistry plays. Their examples of the interplay between laser drilling, the chemical makeup of the substrate layers, and the plating process are worth a listen.

We continue our conversation with Chris Ryder on the Optimize the Interconnect(SM) concept. Chris shares some specific examples and details how and why industry leaders are adopting the OTI approach.

Beth Turner joins the podcast to discuss her book, The Printed Circuit Assembler's Guide to Encapsulating Sustainability for Electronics. The conversation ranges from the most common encapsulation materials used, to when and why to use them. Turner points out that encapsulation materials are also experiencing a creative time with respect to both performance and sustainability. A must-read for anyone with a role in specifying or applying encapsulation materials.

OTI, or "optimize the interconnect," is a concept approach to producing higher quality, higher complexity PCB products. Chris Ryder, MKS Director of Business Development, introduces the concept and sets the stage for a more detailed discussion.

Martyn Gaudion spills the tea on his third book, sharing more secrets for successful high-speed design.

We continue our conversation with Ryan Miller, and we get practical about design and manufacturing techniques to manage thermal effects, including such structures as via farms, insulated metal substrates, coin technology, and copper pedestals.

Ryan Miller takes Nolan Johnson through strategies for managing heat that can be applied during the design planning and specification phases. Prevention means there is less to mitigate.

In this kickoff episode, Ryan Miller makes the case for why thermal management needs to be on the minds of the designers. But what are the main causes of excess heat in our designs today? Join us as we start by defining the problems, then turn to the array of solutions.

Scott Miller and Brian White join host Nolan Johnson to discuss Miller's book, The Printed Circuit Designer's Guide to Executing Complex PCBs. Miller and White add insight to the seven key disciplines required by designers to successfully design complex PCBs. Of course, in this fast-moving industry, they also provide updated perspectives.