Circuit test, inspection, and failure analysis are enjoying a rapid increase in capabilities and sophistication. Test companies, such as Datest, are capable of testing methods we could only dream of ten years ago. Learn how Datest uses their expertise to not only perform high-quality failure analysis, but also to become a valuable DFT resource for the design team.

Continuing our discussion with ASC's John Johnson, we explore the pluses and minuses of copper plating microvias from the perspective of the fabricator and the designer.

Nolan Johnson and ASC's John Johnson explore the implications of UHDI on via from a designer's perspective. The metallurgy, chemistry, mechanics, and stackup reduction mean that designers have fewer constraints with UHDI.

Solder joint reliability is essential to product performance and longevity in electronics. Failures can lead to costly repairs, dissatisfied customers, or even catastrophic loss, depending on the application. In this Voices of the Industry episode, Marcy LaRont talks with Shantanu Joshi of KOKI America about how advanced materials—such as crack-free fluxes and zero-flux-residue solder pastes—are helping address challenges like voiding, heat dissipation, and reliability in demanding environments.

John Johnson continues this series, outlining UHDI's contributions to reduced SWaP—size, weight and power—considerations.

In a thoughtful conclusion to the series, Kuldip Johal connects the key themes, examining market drivers, the technological implications of semiconductor advances, and strategies for aligning PCB production with evolving market demands.

American Standard Circuits' John Johnson details how the new capabilities in UHDI can fundamentally change what it means to design for manufacturability.

Because solder formulations have been enjoying rapid development in the low-temperature solder arena, co-author Pritha Choudhury, senior R&D scientist with MacDermid Alpha, joins Nolan Johnson to discuss the update to The Printed Circuit Assembler's Guide to Low- temperature Soldering. Topics covered include details on key performance traits in low-temperature solder, and Choudhury shares her recommended low-temperature soldering solution.

John Johnson leads the way straight into UHDI's benefits to RF style design.

To launch this series, ASC's John Johnson introduces us to ultra-high-density interconnect. Johnson sets the agenda for further discussion by sharing practical reasons why UHDI could be key to your next design challenge, and why both designers and the manufacturing chain are excited by UHDI's potential.