Electrically conductive adhesives (ECAs) have been touted for decades as a potential replacement for solder. Technology roadmaps by organizations ranging from IPC to the Surface Mount Council often listed ECAs as a “coming” technology, and scores of papers have been presented highlighting possible uses and likely end-products.

The international research firm IDTechEx released in early October a new study called “Electrically Conductive Adhesives 2022-2032: Technologies, Markets, and Forecasts.” Matthew Dyson, Ph.D., a senior technology analyst at IDTechEx specializing in printed, organic and flexible electronics, spoke with Mike Buetow about the study’s findings and the future of ECAs, including in-mold and flexible electronics and their potential applications.