Trevor Galbraith, Editor-in-Chief of Global SMT & Packaging magazine takes a look around Nepcon 2019 to discover the latest products and innovations coming out of Japan this year.

Trevor Galbraith, Editor-in-Chief of Global SMT &amp; Packaging magazine takes a look around Nepcon 2019 to discover the latest products and innovations coming out of Japan this year.

PODCAST: Nepcon Japan 2019 – Day 1

Global SMT &amp; Packaging APP, BLOG, PODCAST, Websites, Newsletters, Magazines, Videos and Social Media platforms (Facebook, Twitter, Linkedin, YouTUBE) are a regular source of information about worldwide trends in the PCBA – Printed Circuit Board Assembly, EMS – Electronics Manufacturing Services, ASM – Advanced Semiconductor Materials, 3D Printing, SMT – Surface Mount Technology, OTS – Open Technology Solutions, SFS – Smart Factory Solutions, IPC – Institute for Printed Circuits. These sources also give you exclusive access to CEO interviews, webinars, white papers, new products, panel discussions and videos interviews from trades shows / conferences / tech open days / networking. If necessary, your subscription can be cancelled at any time!

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Global SMT & Packaging APP, BLOG, PODCAST, Websites, Newsletters, Magazines, Videos and Social Media platforms (Facebook, Twitter, Linkedin, YouTUBE) are a regular source of information about worldwide trends in the PCBA – Printed Circuit Board Assembly, EMS – Electronics Manufacturing Services, ASM – Advanced Semiconductor Materials, 3D Printing, SMT – Surface Mount Technology, OTS – Open Technology Solutions, SFS – Smart Factory Solutions, IPC – Institute for Printed Circuits. These sources also give you exclusive access to CEO interviews, webinars, white papers, new products, panel discussions and videos interviews from trades shows / conferences / tech open days / networking. If necessary, your subscription can be cancelled at any time!

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PODCAST: Nepcon Japan 2019 – Day 1

PODCAST: Nepcon Japan 2019 – Day 1