There is no doubt that technology is only constrained by the pace at which materials science can design and introduce new materials that conduct electricity faster and more reliably in greater temperature ranges using cheaper raw materials. What are the current barriers, opportunities and even threats? This panel will discuss.

Panel: Brian Toleno (Microsoft), Watson Tseng (Shenmao) Tetsuro Nishimura (Nihon Superior), Tom Forsythe (KYZEN Corporation)

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