<p>Eric Camden (lead investigator with Foresite) and Mike Konrad discuss electrochemical migration (ECM) and other failure modes caused by residues on circuit assemblies.</p>

Eric Camden (lead investigator with Foresite) and Mike Konrad discuss electrochemical migration (ECM) and other failure modes caused by residues on circuit assemblies.

RM 117: When Residues Cause Circuit Assemblies to Fail

Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&amp;F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)

News

Technology

Tech News

Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)

Share RM 117: When Residues Cause Circuit Assemblies to Fail

Sign up to save your podcasts

RM 117: When Residues Cause Circuit Assemblies to Fail

RM 117: When Residues Cause Circuit Assemblies to Fail