<p>Eric Camden (lead investigator with Foresite) and Mike Konrad discuss electrochemical migration (ECM) and other failure modes caused by residues on circuit assemblies.</p>

Eric Camden (lead investigator with Foresite) and Mike Konrad discuss electrochemical migration (ECM) and other failure modes caused by residues on circuit assemblies.

RM 117: When Residues Cause Circuit Assemblies to Fail

Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)

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Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&amp;F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)

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RM 117: When Residues Cause Circuit Assemblies to Fail

RM 117: When Residues Cause Circuit Assemblies to Fail

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