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RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.
The guests may be reached here:
Tim O'Neill
AIM Solder
www.aimsolder.com
Prakash Gango
StenTech
www.stentech.com
Kalyan Nukala
www.zestron.com
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By PCEA
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Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.
The guests may be reached here:
Tim O'Neill
AIM Solder
www.aimsolder.com
Prakash Gango
StenTech
www.stentech.com
Kalyan Nukala
www.zestron.com
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