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In late 2018, IPC shocked the electronics assembly community by introducing an amendment to section 8 of the J-STD-001G. This amendment radically changed the way industry determines cleanliness. Now, assemblers must prove their assemblies are clean enough not to experience electrochemical migration events which would cause the assembly to fail.
Naisbitt is an IEC 1906 Lord Kelvin Award Winner, IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards, and a British Standards Institution EPL-501 Member.
He is a specialist in surface insulation resistance testing, ionic contamination control, solderability, conformal coating materials and application systems, cleaning, inspection and test.
By PCEA5
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In late 2018, IPC shocked the electronics assembly community by introducing an amendment to section 8 of the J-STD-001G. This amendment radically changed the way industry determines cleanliness. Now, assemblers must prove their assemblies are clean enough not to experience electrochemical migration events which would cause the assembly to fail.
Naisbitt is an IEC 1906 Lord Kelvin Award Winner, IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards, and a British Standards Institution EPL-501 Member.
He is a specialist in surface insulation resistance testing, ionic contamination control, solderability, conformal coating materials and application systems, cleaning, inspection and test.

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