Gartner’s $717 Billion Semiconductor Forecast: Driven by AI and GPUs, the market is set to hit $717 billion by 2025, despite slower growth in automotive and industrial sectors.

Siemens’ $10 Billion Altair Acquisition: Siemens strengthens its AI-powered simulation software lineup for automotive and aerospace, navigating overlaps with Altium.

Siemens & CELUS PCB Partnership: Siemens and CELUS streamline PCB design for small teams with AI, enhancing productivity and reducing repetitive tasks.

Infineon’s Ultra-Thin Power Wafer: Infineon launches the thinnest silicon wafer, reducing power loss by 15% for energy-intensive AI data centers.

Supermicro’s 35% Stock Drop: Supermicro’s stock dives following Ernst & Young’s resignation as auditor, citing concerns over management.

Intel’s $16 Billion Loss & AI Focus: Despite restructuring losses, Intel is pushing forward with AI strategies, major Amazon partnerships, and advanced 18A chips.

China’s Rare Earth Export Restrictions: China tightens rare earth exports, essential for chips, while the U.S. penalizes GlobalFoundries, intensifying trade tensions.

Russia’s Tech Imports Amid Sanctions: Russian companies obtain high-end Dell servers with AI processors, highlighting global adaptations to restrictions.

JEDEC’s LP5CAMM2 Connector Standard: JEDEC’s new LP5CAMM2 standard enhances LPDDR5 memory, boosting signal integrity and thermal performance.

STMicroelectronics’ Wearable Biosensor: STMicro’s compact biosensor chip enables AI functions in wearables, like heart rate monitoring and step counting.

TSMC’s High-NA EUV Machine: TSMC and Intel acquire high-NA EUV machines from ASML, with TSMC eyeing the tech for its A10 process by 2030.

Samtec’s 2mm Board-to-Board Connector: Samtec’s new high-speed connector is ideal for rugged automotive, IoT, and aerospace applications.