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Tech Titans Unleashed: NEO Semiconductor's 3D DRAM Revolution and Apple's Unified A18 Chipset for iPhone 16
NEO Semiconductor introduces a groundbreaking 3D DRAM with integrated AI processing, aiming to replace current HBM technology and address data bus bottlenecks. Meanwhile, Apple's upcoming A18 chipset is expected to be featured across all iPhone 16 models, raising questions about potential specification differences between the 'Pro' and non-Pro versions.
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By Spod Media LLCNEO Semiconductor introduces a groundbreaking 3D DRAM with integrated AI processing, aiming to replace current HBM technology and address data bus bottlenecks. Meanwhile, Apple's upcoming A18 chipset is expected to be featured across all iPhone 16 models, raising questions about potential specification differences between the 'Pro' and non-Pro versions.