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Terecircuits revolutionize high volume pick and place and SiP assembly
In an intriguing Tech Talk interview, Terecircuits have developed a polymer carrier that can pickup large amounts of devices in one pass and use a high-powered UV laser to deposit them with high accuracy on the substrate. The polymer material vaporizes during the process.
In a separate develop, the same technology is being used to assemble chiplets in SiP Devices without the use of solder.
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By Global SMT & PackagingIn an intriguing Tech Talk interview, Terecircuits have developed a polymer carrier that can pickup large amounts of devices in one pass and use a high-powered UV laser to deposit them with high accuracy on the substrate. The polymer material vaporizes during the process.
In a separate develop, the same technology is being used to assemble chiplets in SiP Devices without the use of solder.