The AI gold rush is fueling record highs in semiconductor stocks, but cracks are appearing beneath the surface. In this debut episode of Inside Taiwan, we dive into the paradox shaping markets today: Wall Street euphoria versus economic warning signs.

We trace the story from recent headlines, TSMC’s advanced packaging bottleneck, Intel’s reported foundry discussions, and Samsung’s mega-bet on HBM memory, back to the pioneers who built Taiwan’s semiconductor ecosystem brick by brick. Along the way, we uncover how Taiwan’s “chip peace” philosophy, Japan’s rising partnership, and a looming $1.5 trillion funding gap are redefining the future of AI.

You’ll discover:

• Why TSMC’s CoWoS packaging is the hottest bottleneck in AI.
• How fabless design companies reshaped the industry and made NVIDIA possible.
• What “Chip Peace” means, and why it matters more than “Chip War.”
• Why Japan’s materials and equipment synergy with Taiwan is creating a new regional powerhouse.
• The trillion-dollar question: can the AI revolution survive if cheap capital runs dry?

Content Keywords:

• Taiwan semiconductors
• TSMC
• semiconductor supply chain
• advanced packaging / CoWoS
• silicon IP
• fabless chip design
• GPU war 
• NVIDIA
• AMD
• HBM memory
• RCA

Want to learn more about Taiwan’s semiconductor journey? Check out the documentary A Chip Odyssey.

【About the Show】

Inside Taiwan distills 200 stories a day from over 30 trusted Traditional Chinese and English sources into a ten-minute executive briefing. Powered by KimFion Lab, it’s an AI-powered signal over noise for global investors and decision-makers navigating the world’s most valuable supply chain.

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