Lucas and Luna dive into the unsung science of thermal management in modern chips. From the IBM z16 mainframe's liquid-cooled design to Apple's M-series unified thermal spreaders, they explore how heat dissipation is becoming the bottleneck in performance scaling. The episode features a detailed breakdown of heat sink design principles, the shift from thermal paste to liquid metal TIMs, and why data centers are now prioritizing power density over clock speed. A must-listen for hardware engineers and tech enthusiasts curious about the physics behind every degree of chip temperature.

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