This is Part 2 of a new podcast in which guest Geoffrey Leeds of Leeds AI joins Matt Leary (Newgrange Design), Geoffrey Hazelett (FreedomCAD) and Mike Buetow (PCEA) to discuss the semiconductor/packaging/PCB technology stack and what over the next two to five years will have the biggest impact on the industry at the board level.

The conversation covers heterogeneous packaging, interposers, the density scale equation, silicon to systems, die desgregation, and photonics, among others. 

Part 1 discusses the supply chain situation and how the industry can adapt.