The market for Bottom Termination Components (BTCs) is growing rapidly, but these components have brought new challenges in design and assembly processes. The large areas of the solder terminals bring many advantages with them, like dissipating heat of the component. However, if the assembly process is not properly adjusted, then this can cause voids under the component. In today's podcast, we'll discuss the work carried out to evaluate the challenges of voids on the WE-MAPI and other DFN products.

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