Episode 39 of Quantum Computing Business with Fexingo digs into the unsung bottleneck of quantum scaling: advanced chip packaging. Lucas and Luna explain why linking qubits across multiple chips is harder than building the qubits themselves, and how a startup called QP-Tech just raised $45 million to solve it with a novel cryogenic interposer. They explore the physics of thermal mismatches, the economics of modular quantum systems, and why packaging may determine who wins the race to fault-tolerance. Along the way, they touch on the surprising role of legacy semiconductor supply chains and why Intel's packaging patents could give it a dark-horse advantage. A concrete look at the infrastructure problem nobody talks about at quantum conferences.

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