EUV lithography (EUVL) is the key technology for continuing chip miniaturization. It uses extremely short-wavelength light (13.5 nm) to expose the finest structures. This sophisticated process is the result of close cooperation between ASML (systems), ZEISS (optics), and TRUMPF (lasers). TRUMPF high-power lasers generate plasma from tin droplets 50,000 times per second, which emits the EUV light. Since EUV radiation is absorbed by air, the entire process runs in a vacuum with the aid of ultra-precise multilayer mirrors. ASML is the sole manufacturer and enables production for 3 nm nodes. Future high-NA systems (0.55 NA) are expected to achieve 2 nm nodes. This article was created with the help of AI. Please verify the information if you intend to use it as a basis for your decision-making.

This article was created with the help of AI. AI can make mistakes. Please verify the information if you intend to use it as a basis for your decision-making.