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This week’s episode argues that EUV is becoming less of a pure lithography story and more of an infrastructure story. The most useful signals are commercial productization at Intel, long-duration power procurement at ASML, larger geographic ambition around TSMC, and policy moves that could affect the usable life of installed tools. It was a relatively light week for fresh scanner disclosures, so the emphasis is on economics, contracts, and industrial positioning.

Key takeaways

- Intel said its Core Ultra Series 3 with vPro is the first commercial PC platform built on Intel 18A, covering more than 125 business designs.

- RWE expanded and extended its renewable power agreement with ASML to 130 megawatts through 2038.

- The reported plan for TSMC to build 12 fabs, four packaging facilities, and an R&D center in Arizona remains unconfirmed and should be treated as rumor, not company guidance.

- Reuters reported that proposed U.S. legislation would not only restrict certain chipmaking equipment sales to China but also halt servicing for named Chinese chipmakers.

- SK hynix’s disclosed order for about 11.95 trillion won of ASML tools remains one of the clearest signs that memory makers are reserving future lithography capacity early.

- Broadcom said TSMC capacity is a bottleneck in 2026 and that customers are increasingly signing multi-year supply agreements.

- Broadcom’s new long-term deal to develop Google’s custom AI chips through 2031 shows that end-market demand is becoming more contractual and longer dated.

- ASML said in its 2025 annual report that EUV revenue should increase significantly in 2026 because of advanced logic and DRAM demand.

- This was a lighter week for brand-new EUV tool announcements, so some near-term uncertainty remains around exact fab and tool timelines.

Glossary

Extreme Ultraviolet (EUV) — Lithography that uses 13.5-nanometer light for the most advanced chip patterning.

Deep Ultraviolet (DUV) — Older lithography technology that still handles a large share of commercial chip production.

High Bandwidth Memory (HBM) — Stacked memory used heavily in artificial-intelligence accelerators and servers.

Power Purchase Agreement (PPA) — A long-term contract to buy electricity at agreed terms.

Advanced packaging — Methods that connect multiple chiplets or dies into one high-performance package.

Installed base — The tools already operating at customer sites and generating output and service revenue.

18A — Intel’s leading-edge process generation now moving from launch claims into commercial products.

Dynamic Random-Access Memory (DRAM) — Mainstream working memory used in servers, personal computers, and many other systems.