One of the challenges of designing 3D IC chips is getting data from different sources in different formats to work together. You also need a solution that allows you to verify different components such as the interposer, the package, and the die together. Siemens solution allows you to combine data from different sources and handle the verification process collectively.

Today, John McMillan interviews Mike Walsh, Technical Applications Engineering Director of the Technical Solutions Sales Team at Siemens Digital EDA. He’ll help understand what a 3D IC physical design workflow might look like.

In this episode, you’ll learn about the challenges associated with 3D IC physical design. You’ll also learn about how Siemens solution enables design teams to use data received in different formats. Additionally, you’ll learn why it's important to keep verification in mind early on in the design process.

What You Will Learn in this Episode:

Connect with Mike Wash: 

• LinkedIn

Connect with John McMillan: 

• LinkedIn

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