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In this episode of Embedded Insiders, Dunstan Power, Director of ByteSnap Design, unpacks the strategic and practical implications of Europe’s investment in the semiconductor industry. Dunstan shares his perspective on how this funding could bolster Europe’s chip manufacturing capabilities, address global supply chain challenges and foster innovation for companies like ByteSnap and its clients.

Next, Rich sits down with Steve Hanna, Distinguished Engineer at Infineon Technologies, to discuss the role of Zero Trust Architecture (ZTA) in reshaping the cybersecurity landscape.

But first, Rich and Ken delve into the ongoing potential pitfalls and challenges U.S. manufacturers may encounter with the CHIPS Act. What could these developments mean for developers and the future of the semiconductor industry? Stay tuned.

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In this episode of Embedded Insiders, we dive into the challenges and solutions shaping AI and identity verification. Pavel Goldman-Kalaydin, Head of AI and Machine Learning at Sumsub shares how his team is tackling deepfake threats while addressing privacy and ethics concerns with cutting-edge, AI-driven tech.

Later, Rich and Vin chat with Maher Matta, President of the Americas at Infineon Technologies. From his early days as a bench engineer to leading a thriving tech powerhouse, Maher shares the highs, lows, and lessons from his remarkable journey.

But first, Rich and Ken break down the latest AI news featuring two industry giants. 

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On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.

Next, Rich is joined by Sayeed Ahmed, director at Infineon Technologies, to discuss the electrification of software-defined vehicles, according to Ahmed, there are still some tradeoffs and issues to be solved.

But first, Rich gives us a sneak peek into his trip to Munich for electronica 2024. Stay tuned to hear about the sessions and the top innovators of our Best-in-Show awards. 

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On this episode of Embedded Insiders, we’re joined by David Bartlett, Head of Technology in the business unit at u-blox, to explore how low-earth orbit (LEO) satellites could elevate positioning, navigation, and timing (PNT) services. Are satellites closer to Earth the answer to providing reliable PNT in the toughest environments?

Then, Rich and Vin sit down with Frank Norris, author of Colonizing Mars, to discuss what it would take to establish a human colony on the Red Planet, and the challenges of establishing a permanent colony there. 

But first, we dive into AI and security. Building on a recent conversation with BlackBerry, I ask Rich and Ken to unpack the complexities of using AI to secure systems against AI-driven threats. How do we ensure that AI solutions stay reliable without introducing new risks?

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In this episode of Embedded Insiders, we're joined by Sriram Krishnan, BlackBerry's Head of Product Management, to discuss CylanceMDR, their AI-powered managed detection and response solution. We’ll explore how its XDR architecture enhances security by seamlessly integrating with existing tools, enabling more efficient threat detection and response.

Tolly Report on BlackBerry’s CylanceENDPOINT

Later, Rich sits down with Marcelo Williams, Global Senior Director at Infineon Technologies, to discuss the fast-approaching era of software-defined vehicles (SDVs) and their impact on the automotive industry.

But first, Rich, Ken, and I will recap Embedded World North America, highlighting standout sessions, hands-on workshops, and the winners of our Best-in-Show awards. If you missed it, we’ve got you covered!

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In this episode of Embedded Insiders, we take a deep dive into the newly announced HBM4 Memory Controller IP from Rambus, with insights from Fellow and Distinguished Inventor Steven Woo. Rambus is leading the way with its  silicon IP portfolio, and Steven shares his perspective on the latest memory industry trends, the challenges it faces, and the impact of AI on memory technologies.

Later, Rich sits down with Rob Oshana, the Senior Vice President of the Software and Security Group at Analog Devices to discuss how the company has transformed from being a traditional analog supplier into a vendor who delivers a mix of software with development kits and IDEs that bring all the technologies together.

But first, Rich and Ken discuss the resurgence of reference designs and white-labeling, driven by increasing demands for flexibility, ease of use, and faster time to market.

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In this episode of Embedded Insiders, we take a deep dive into the newly announced HBM4 Memory Controller IP from Rambus, with insights from Fellow and Distinguished Inventor Steven Woo. Rambus is leading the way with its cutting-edge silicon IP portfolio, and Steven shares his perspective on the latest memory industry trends, the challenges it faces, and the transformative impact of AI on memory technologies.

Later, Rich sits down with Helmut Puchner, Vice President and Fellow in Infineon Technologies' Aerospace and Defense division, to explore the intricacies of radiation-hardened (rad-hard) memory. They break down what makes rad-hard memory unique, where it's essential, and how it differs from conventional memory.

But first, Rich and Ken discuss the resurgence of reference designs and white-labeling, driven by increasing demands for flexibility, ease of use, and faster time to market.

For more information, visit embeddedcomputing.com

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On this episode of Embedded Insiders, we’re joined by Calista Redmond, CEO of RISC-V International, and Andrea Gallo, VP of Technology, as they dive into the organization’s latest technical breakthroughs, the evolving RISC-V software ecosystem, and how RISC-V is making an impact in the AI/ML sectors—and beyond.

Register for the upcoming RISC-V Summit in Santa Clara, CA on October 22-23, 2024.

Later, Rich chats with Ray Notarantonio, Senior Director at Infineon, to uncover the 'true' definition of a software-defined vehicle (SDV). They explore the future possibilities of SDVs, the timeline for their broader adoption, and the challenges still in the way.

But first, Rich and Ken provide a sneak peek into what’s in store at the Embedded World North America conference and exhibition, happening October 8-10 in Austin, Texas. For just $30, attendees can participate in one of three hands-on workshops sponsored by Analog Devices, NXP Semiconductors, and STMicroelectronics—each designed to help you jumpstart your next application.

Don’t wait! Check out the links below for more details and to register—spots are filling up fast!

• Embedded Development using Zephyr & Open Source Tooling
• Fast-Track your IoT Development with NXP’s Wireless Microcontrollers
• Hands-On Training with Free Nucleo-H7S3L8 Dev Board

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On this episode of Embedded Insiders, Wayne Lyons, AMD’s Automotive Senior Director, provides an update on AMD’s automotive business, trends, and vision for the future. Wayne also dives into the company’s recent advancements in automotive processors like the Versal AI Edge Series, and their success with companies deploying their solution, like Subaru.

Next, Rich and Vin are back with another Dev Talk discussing the importance of requirements-management tools, and why they are a “must-have,” with Neil Stroud, General Manager for Automotive and Semiconductor at Jama Software.

But first, Rich and Ken discuss the upcoming embedded world North America conference and exhibition set for October 8-10 at the Austin Convention Center in Austin, Texas. Now, the call for papers has closed, but keep listening to hear how to prepare for the event, what to expect, and how to get the most out of your attendance.

For more information about AMD's offerings, check out the links below:

• AMD Press Release: AMD Extends Leadership Adaptive SoC Portfolio with New Versal Series Gen 2 Devices Delivering End-to-End Acceleration for AI-Driven Embedded Systems  
• AMD Versal AI Edge Series Gen 2: Versal AI Edge Series Gen 2 (amd.com) 
• AMD Automotive Solutions: Automotive Solutions (amd.com) 

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On this episode of Embedded Insiders, Jack Weast, Intel Fellow and Vice President and General Manager of Intel Automotive, breaks down the company’s recently announced OLEA U310 SoC. Built with a hybrid and heterogeneous architecture, the solution is designed to improve the overall efficiency of electric vehicles by promoting energy efficiency, and lower design and manufacturing costs.

Next, Rich and Vin are back with another Dev Talk discussing the embedded developers’ approach to the testing process, specifically the pros and cons of waiting to test prototypes once they’re complete, and the testing tools every developer should have in their toolbox.

But first, Rich, Ken, and I discuss the current state of electric vehicles and our curiosity about Intel's approach to the market.  

For more information, visit embeddedcomputing.com