Automotive manufacturing has been a primary driver in the growth in sales of the Koh Young pin insertion machine, launched earlier this year. The company is enjoying a banner year and looking forward to moving to a new US headquarters in Atlanta, GA in early 2019.

For small- to medium-sized manufacturers looking to start gathering data from the oven and integrate it with an MES system or other software interface, KIC make the transition easy with this intuitive new product.

The Fox 2 is the most successful pick and place system to come out of the Essemtec stable. Built on a composite base for rigidity and fitted with linear motors for accurate placement, it accommodates up to 180 feeders for high-mix manufacturing.

Tom Forsythe discusses the implications for cleaning technology as miniaturisation drives it to become mainstream.

Paul Lancaster describes the latest updates to their Wincon suite of oven control, management and maintenance softwares on the Windows 10 platform.

David Burford brings you some of the week's top stories from around the electronics manufacturing industry including Swedish EMS’s company’s expansion into neighboring Norway, Imperial College London using holographic lecturers, Industry veteran joins Southwest Systems Technologies and more!

Global SMT & Packaging Editor-in-Chief Trevor Galbraith is joined by Michael Skinner followed by Keith Bryant, YXLON and Paul Smith, LAB One.

Miniaturization and an increasingly high-mix environment are placing increasing pressure for the entire inspection system to work faster, more efficiently and communicate with other test equipment to provide real-time data feedback and yield improvement.

Inspection is at the heart of the line optimization debate. They act as the eyes and sensors for all the production equipment on the line. This panel will discuss how these systems need to evolve to meet the needs of an automated production line.

Failure analysis is one of these functions that happens after the fact, but manufacturers need to learn the important lessons from field failures to improve the design and manufacturing process and prevent reoccurrences and potentially catastrophic failures.

Continuous miniaturization, harsh environments and the need for traceability all present challenges to those who seek to produce levels of cleanliness that meet or exceed IPC – TM-650. This panel discusses these issues.