Intel Chip Chat

Justin Bandholz, a Portfolio Manager at Lenovo, stops by to announce the launch of a portfolio of products based on the Intel® Xeon® processor E5-2600 v3, including a premier 2-socket 1 and 2U rack servers, the ThinkServer* RD550 and ThinkServer RD650, as well as a 2-socket ThinkServer TD350 tower server. New fabric and storage technologies in the product portfolio are providing breakthroughs in flexibility for configuration of systems to suit customer workload needs. For more information, visit http://lenovo.com/us/en/servers.

Charles Liang, Founder, President, CEO, and Chairman of the Board and Don Clegg, VP of Marketing and Business for Supermico discuss how the company has launched more than 50 platform designs optimized for the Intel® Xeon® processor E5 v3. Supermicro provides solutions for data center, cloud computing, enterprise IT, Hadoop/big data, HPC and embedded systems worldwide and focuses on delivering increased performance per watt, performance per square foot, and performance per dollar. For more information, visit www.supermicro.com.

Brian Payne, Executive Director of PowerEdge Product Management at Dell, chats about the Dell PowerEdge* 13G server line featuring the recently-launched Intel® Xeon® processor E5 v3. Flash server integration into the PowerEdge 13G is delivering immense increases in application and database performance to help customers meet workload requirements and adapt to new scale-out infrastructure models. For more information, visit www.dell.com

Vin Sharma (@ciphr), the Director of Planning and Marketing for Hadoop at Intel chats about collecting and extracting value from data. The Intel® Galileo Development Kit’s hardware and software components allow users to build an end-to-end solution while the Intel® Internet of Things Analytics Kit provides a cloud-based data processing platform. For more information, visit www.intel.com/galileo.

Gautam Shah, the CEO of Colfax International, chats about how the Intel® Xeon® processor E5 v3 is a complete solution stack upgrade, including processor, networking and storage components, which allows customers to tackle problems they haven’t previously been able to solve cost-effectively (or at all). Colfax is delivering solutions with increased DDR4 memory, 12gb/s SAS, integrated SSDs, and networking solutions, which offer a great leap in system innovation. For more information, visit www.colfaxinternational.com or email [email protected] with any questions.

Peter Evans, a VP & Marketing Executive in HP’s Server Division, chats about the ProLiant* Generation 9 platform refresh, the foundation of which is the Intel® Xeon® processor E5 v3. The ProLiant Gen9 platform is driving advancements in performance, time to service, and optimization for addressing the explosion of data and devices in the new data center. For more information, visit www.hp.com/go/compute.

Roberto Basilio, the VP of Storage Product Management at Hitachi Data Systems, discusses the launch of the Intel® Xeon® processor E5 v3 and, in particular, how virtual machine control structure (VMCS) shadowing is innovating virtual machine management in the cloud. Shadowing improves the performance of Nested Virtualization and reduces latency and improves energy efficiency. For more information, visit http://www.hds.com/products/hitachi-unified-compute-platform/.

Brian Connors, the VP of Global Product Development and Lab Services at IBM, stops by to talk about the launch of the company’s new M5 line of towers, racks and NeXtScale systems based on the Intel® Xeon® processor E5 v3. The systems have been designed for increased security (Trusted Platform Assurance and Enterprise Data Protection), efficiency and reliability and offer dramatic performance improvements over previous generations. For more information, visit www.ibm.com.

Jeni Panhorst, Senior Product Line Manager at Intel, stops by to talk about the launch of the Intel® Communications Chipset 8900 series with Intel® QuickAssist Technology, which delivers cryptography and compression acceleration that benefits a number of applications. Use cases for the new chipset include securing back-end network ciphers to improve efficiency of equipment while delivering real-time cryptographic performance requirements, as well as network optimization – compressing data in the flow of traffic across a WAN. For more information, visit www.intel.com.

Justin Bandholz, a Portfolio Manager at Lenovo, stops by to announce the launch of a portfolio of products based on the Intel® Xeon® processor E5-2600 v3, including a premier 2-socket 1 and 2U rack servers, the ThinkServer* RD550 and ThinkServer RD650, as well as a 2-socket ThinkServer TD350 tower server. New fabric and storage technologies in the product portfolio are providing breakthroughs in flexibility for configuration of systems to suit customer workload needs. For more information, visit http://lenovo.com/us/en/servers.