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In this live episode from Transact 360, we talk with Don Smith, General Manager of Integrated Payments at Transact, about the rapid evolution of student payments. Don shares insights on how unified payment systems improve the student experience, the growing demand for financial flexibility, and how institutions can remove friction from the payment process. We also explore AI, embedded finance, and the future of digital wallets on campus.
Guest Name: Don Smith - General Manager of Payments at Transact
Guest Social: LinkedIn
Guest Bio: With over 15 years of experience driving innovation in software and financial services, Don is a seasoned product leader specializing in building high-performing teams. Skilled in talent development and cross-functional collaboration, Don creates cultures of excellence in both startups and established corporations across diverse industries, including education, financial services, nonprofits, and commercial real estate.
Don came to Transact + CBORD after serving as the Chief Product Officer at MountainSeed for three years. He excels at translating stakeholder insights into strategic product visions and actionable roadmaps, consistently delivering revenue growth and disciplined cost control.
Passionate about leveraging technology to solve real-world challenges, Don thrives in fast-paced environments that push the boundaries of innovation.
- - - -
Connect With Our Host:
Dustin Ramsdell
https://www.linkedin.com/in/dustinramsdell/
About The Enrollify Podcast Network:
The Higher Ed Geek is a part of the Enrollify Podcast Network. If you like this podcast, chances are you’ll like other Enrollify shows too!
Enrollify is made possible by Element451 — the next-generation AI student engagement platform helping institutions create meaningful and personalized interactions with students. Learn more at element451.com.
Attend the 2025 Engage Summit!
The Engage Summit is the premier conference for forward-thinking leaders and practitioners dedicated to exploring the transformative power of AI in education. Explore the strategies and tools to step into the next generation of student engagement, supercharged by AI. You'll leave ready to deliver the most personalized digital engagement experience every step of the way.
Register now to secure your spot in Charlotte, NC, on June 24-25, 2025! Early bird registration ends February 1st -- https://engage.element451.com/register
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In this live episode from Transact 360, we talk with Don Smith, General Manager of Integrated Payments at Transact, about the rapid evolution of student payments. Don shares insights on how unified payment systems improve the student experience, the growing demand for financial flexibility, and how institutions can remove friction from the payment process. We also explore AI, embedded finance, and the future of digital wallets on campus.
Guest Name: Don Smith - General Manager of Payments at Transact
Guest Social: LinkedIn
Guest Bio: With over 15 years of experience driving innovation in software and financial services, Don is a seasoned product leader specializing in building high-performing teams. Skilled in talent development and cross-functional collaboration, Don creates cultures of excellence in both startups and established corporations across diverse industries, including education, financial services, nonprofits, and commercial real estate.
Don came to Transact + CBORD after serving as the Chief Product Officer at MountainSeed for three years. He excels at translating stakeholder insights into strategic product visions and actionable roadmaps, consistently delivering revenue growth and disciplined cost control.
Passionate about leveraging technology to solve real-world challenges, Don thrives in fast-paced environments that push the boundaries of innovation.
- - - -
Connect With Our Host:
Dustin Ramsdell
https://www.linkedin.com/in/dustinramsdell/
About The Enrollify Podcast Network:
The Higher Ed Geek is a part of the Enrollify Podcast Network. If you like this podcast, chances are you’ll like other Enrollify shows too!
Enrollify is made possible by Element451 — the next-generation AI student engagement platform helping institutions create meaningful and personalized interactions with students. Learn more at element451.com.
Attend the 2025 Engage Summit!
The Engage Summit is the premier conference for forward-thinking leaders and practitioners dedicated to exploring the transformative power of AI in education. Explore the strategies and tools to step into the next generation of student engagement, supercharged by AI. You'll leave ready to deliver the most personalized digital engagement experience every step of the way.
Register now to secure your spot in Charlotte, NC, on June 24-25, 2025! Early bird registration ends February 1st -- https://engage.element451.com/register
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