PCB Chat

PCB Chat

By PCEANewsTechnologyTech News
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PCB Chat episodes

  • Reliability Matters: Episode Episode 32: A Conversation with Greg Smith and Tony Lentz about Stencil Design and Void Reduction

    Greg Smith and Tony Lentz talk with Mike Konrad about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper titled "Root Cause Stencil Design for SMT Component Thermal Lands," which is available here:  https://tinyurl.com/szx3xt8.


    56 min
  • Reliability Matters: Episode 26 - Alun Morgan of Ventec

    Alun Morgan and Mike Konrad talk cars, and the increased reliability expectations associated with their electrical systems. The electronics in modern vehicles provide an unpresented level of safety, not just for the driver, but for those people and objects around the vehicle. Because our cars go in and out of harsh environments, the circuit assemblies within the car are subjected to heat, humidity (and other sources of moisture), which contribute to reliability and therefore safety. They discuss one of the primary failure mechanisms of circuit assemblies, an issue that can affect the operation of the safety systems within the automobile, it’s a real issue that for many is not well known.

    1 hr 3 min
  • PCB Chat Episode 48: Dr. Puneet Gupta of UCLA

    According to Puneet Gupta, Ph.D. and his colleagues at UCLA including Subramanian Iyer, Ph.D., the printed circuit board is a constraint on electronics size and speed. And the solution is to get rid of it. The professors have developed a method to replace PCBs with an all-silicon technology, called silicon-interconnect fabric, which allows bare chips to be connected directly to wiring on a separate piece of silicon. The wiring between chips on fabric is at the nanometer scale, much like the wiring within a chip. Dr. Gupta asserts many more chip-to-chip connections are thus possible, and those connections are able to transmit data faster while using less energy. He discusses the technology and its implications with PCB Chat host Mike Buetow.

    18 min
  • Reliability Matters: Episode 25: An Interview with Indium's Kay Parker

    Indium's Kay Parker discusses SMT solder paste printing and her experience as a new engineer in the electronics assembly industry with Mike Konrad.


    Kay is a technical support engineer based at Indium headquarters in Clinton, NY. In this role, she provides guidance and recommendations to customers related to process steps, equipment, techniques, and materials. She is also responsible for servicing the company’s existing accounts and retaining new business. She joined Indium as a college intern. During her internship, she worked alongside process engineers in Indium's Metals and Compounds division. After graduating from the State University of New York Polytechnic Institute in 2018, Kay joined the company as a technical support engineer.

    At SUNY Poly, Kay earned a bachelor’s degree in applied mathematics with a minor in engineering science. Her past accomplishments include managing the details of a National Science Foundation grant, forming and leading an award-winning competitive student robotics club, developing industrial manufacturing process technologies, and modeling the flow of blood in the human eye using mathematical equations and computer programs.

    43 min

About PCB Chat

From the publisher's feed

Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)