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What does Cadence's acquisition of EMA Design Automation mean for the respective companies, and the market? Mike Buetow considers the issues related to the EDA giant's acquisition of its largest VAR.
Scott Bright is co-founder and COO of Cadstrom IO, a new company that is coming up with tools for resolving some of the engineering problems that designers and engineers are encountering daily.
Bright has more than 35 years of technology and management experience, including three years at IoT company Jiva, where he was CEO, and 13 at the engineering firm Synapse, which he co-founded and was CEO.
Bright has designed hardware from back of the envelope sketch to high volume manufacturing for everything from commercial to the highest-reliability applications. As a career hardware developer, he understands the software problems endemic to product development.
He discusses Cadstrom's new platform for catching errors the ERC flow misses with Andy Shaughnessy and Mike Buetow of PCEA.
In electronics manufacturing, defects don’t usually announce themselves. They happen in milliseconds, far faster than human perception, and often long before anyone realizes a process has drifted out of control. By the time failures show up in test, inspection, or worse, in the field, the root cause may be buried deep inside machine behavior that no one thought to question.
Wally Rhines the spokesperson for the ESD Alliance, part of Semiconductor Equipment and Materials International. He joins Mike Buetow each quarter to share details from the latest ESD Alliance report on sales of computer-aided engineering tools, semiconductor tools, PCB design software, related IP and services, and employment.
We discuss:
Jon Urquhart is director of global applications engineering at Precision Valve and Automation — one of the world’s leading developers of dispensing, coating, and industrial motion-automation systems. Since joining PVA in 1993, Urquhart has become widely recognized for his expertise in fluid material processing, precision dispensing, and the engineering-to-manufacturing handoff that so often makes or breaks product reliability.
Margaret (Maggie) Frachioni is a semiconductor hardware engineer at General Motors, where, armed with a bachelor’s in computer engineering from Rose-Hulman Institute of Technology, she started out college as a software engineer in its automotive test lab.
While at GM, she started work toward her master’s at Wayne State University in Detroit. Last year, she was part of the first PCEA Certified Printed Circuit Designer course taught as part of a university curriculum.
She speaks with Mike Buetow on her evolving role at GM, her college preparation for electronics engineering, and how the CPCD class altered her career arc from semiconductor methodology to designing and building boards.
Since 2018, Reliability Matters has been building a knowledge vault, capturing the wisdom of industry experts for engineers everywhere.
Mike Konrad continues a dive into the world of contract manufacturing—a vital piece of the electronics ecosystem.
The next two episodes of Reliability Matters will be all about contract manufacturing, an area that can make or break the reliability and success of a product.
If you’re an OEM evaluating partners, an engineer preparing to hand off a design, or someone interested in how contract manufacturers contribute to product reliability, this episode is packed with insights.
Note: This is the fourth of four episodes on the subject of soldering materials.
Today, we're diving into a topic that's reshaping how we think about thermal management, energy efficiency, and long-term performance in electronics manufacturing—low temperature soldering. Joining Mike Konrad is Dr. HongWen Zhang, principal metallurgist and R&D manager of the Alloy Group at Indium Corporation.
Dr. Zhang is not only a seasoned materials scientist with a Ph.D. in materials science and engineering, a master’s in materials science and engineering and in mechanical engineering and a bachelor’s in metallurgical physical chemistry he’s also coinventor of Durafuse, a family of solder alloys that are redefining what's possible at low reflow temperatures—which, reportedly, does not compromise reliability.
In this episode, we’ll explore how low temperature solders are helping manufacturers lower energy consumption, protect heat-sensitive components, and still meet the rigorous mechanical and environmental demands of today’s electronics—from wearables to wafer-level packaging. We’ll also talk about the challenges of brittleness, drop shock resistance, activation and encapsulation of no clean activators, and how cutting-edge materials research is solving problems that used to be considered trade-offs.
Whether you’re a reliability engineer, a process expert, or just solder-curious, this episode is packed with insights you won’t want to miss.
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