Today, we’re diving into one of the most transformative innovations of our time: electric vehicles and the vast infrastructure needed to support their growth. 

Joining us is Brian O’Leary, Global Head of of e-Mobility & Infrastructure at Indium Corporation, a leading expert with deep insights into the electronic assembly industry and its critical role in the EV revolution.

As electric vehicles continue to redefine the future of transportation, the reliability and scalability of the infrastructure that powers them—particularly public EV charging stations—have become pivotal challenges. 

The electronic assembly industry is at the heart of these systems, from the semiconductors enabling fast charging to the sensors ensuring safe and efficient operation. However, with nearly 26% of public EV charging stations estimated to be non-functional at any given time, reliability remains a significant hurdle.

This episode will explore the major reliability issues plaguing public EV charging stations, including power instability, component failures, and environmental challenges.
How innovations in electronics design and assembly can address these challenges, from improving thermal management to leveraging advanced materials like those developed by soldering materials manufacturers.

The exciting opportunities for the electronics industry to lead the charge in building a more resilient, reliable, and efficient EV infrastructure.

Brian O’Leary brings a wealth of knowledge on how advanced materials, smart assembly techniques, and innovative designs can solve these pressing issues and accelerate the adoption of electric vehicles. 

Together, we’ll review the technical challenges, explore solutions, and look ahead to the bright future of electric mobility.

Brian O’Leary's Contact Info:
[email protected]
https://www.indium.com

Today we’re celebrating the end of another incredible year. 

This isn’t just any episode—it’s a time to reflect on the journey we’ve been on together, highlight some milestones, and share a heartfelt thank you to everyone who has made this podcast such a success. Can you believe it? 

Reliability Matters has now released 159 episodes! It feels like just yesterday we started this podcast with the mission to explore how industry experts and their knowledge contribute to the reliability of electronics. And here we are—growing, learning, and making a real impact in our field.

But here’s what blows me away the most: over 85,000 downloads. That’s not just a number—it’s a testament to you, our amazing audience. 

Whether you’re listening in your car or on your morning jog, or watching this on our YouTube channel, you’ve made this podcast part of your journey. And for that, I’m deeply grateful.

This year alone, we’ve covered some fascinating topics. From ultra-high-density interconnects to post-reflow inspection, from thermal profiling to cutting-edge coating materials—we’ve explored it all. Along the way, I’ve had the privilege of sitting down with some of the brightest minds in the electronics industry. 
 
Each guest has brought their unique insights, helping us all better understand the intricate science and art behind building reliable electronics.

To my incredible guests—thank you. Your willingness to share your expertise, stories, and even a few laughs has been the lifeblood of this podcast. Every episode is a reflection of your generosity and brilliance.

I also want to give a shout-out to you—yes, you. Whether you’re a long-time listener or you just discovered us this year, you’re the reason I do this.  The messages, the comments, the emails—it’s all so inspiring. When you tell me how a particular episode helped solve a problem, spark a new idea, or simply make your day better, it reminds me why Reliability Matters matters.

As we wrap up the year, I’m reminded of something I say often on this show: reliability isn’t just a goal; it’s a journey. It’s a series of choices, processes, and innovations that, together, ensure the technology we rely on lives up to its promise. 

And this podcast? It’s a part of that journey. It’s a space where we can learn together, challenge assumptions, and stay ahead of the curve in an ever-evolving industry.

Mike Konrad's Contact Info:
[email protected]
https://www.reliabilitymatterspodcast.com 

Today, I’m excited to introduce the hosts of the D-Code podcast, a dynamic trio of young professionals making waves in the electronics manufacturing industry. 

With experience rooted in contract manufacturing and stencil fabrication for electronic assemblies, they bring a fresh perspective to the table. Although they’re at the start of their podcasting journey, D-Code has already begun to attract attention, tackling industry insights with a unique lens that up-and-coming voices can uniquely offer. 

My guests today are Daniel Stanphill, SMT Process Engineer at Aurora Boardworks, a contract assembler located in Aurora, Nebraska, Sean Kincaid, President of K & F Electronics, located in Fraser Michigan, also a contract manufacturer, and Elias Malfavon, President of Metal Etch Services, a SMT stencil fabricator located in San Marcos California.

I’ll ask them about their experiences, challenges, and how they’re setting out to decode the world of electronics manufacturing.

Contact Information:
The D-Code Podcast
https://www.youtube.com/@The-D-Code

Daniel Stanphill
Aurora Boardworks
[email protected]
https://auroraboardworks.com

Sean Kincaid
K & F Electronics
[email protected]
https://www.circuitboards.com

Elias Malfavon 
Metal Etch Services
[email protected]
https://metaletchservices.com

On today’s episode, we’ll be exploring the critical steps to avoid contamination on circuit assemblies during the rework process with our expert guest, Gayle Towell. 

Gayle is the Content Marketing Specialist at AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry. She holds master's degrees in both mathematics and physics from the University of Oregon and has nearly two decades of experience in higher education, technical writing, and creative writing. 

In her role at AIM Solder, Gayle is instrumental in producing technical and research-based materials, while also collaborating with industry partners on various projects.  She has contributed articles to industry publications, such as the Printed Circuit Engineering Association Magazine, where she discusses topics like solder paste powder sizes and mixing methods.
 
Gayle has also participated in industry events, including the SMTA International conference, where she shared her expertise in sessions covering soldering technologies and solder paste advancements. Additionally, she has appeared on podcasts discussing the development of new solder products. 
Her extensive background in technical communication and her role at AIM Solder highlight her significant contributions to the electronics manufacturing industry, and today she’ll be sharing her insights from a recent technical article "What's on Your Rework Bench."

In this discussion, we’ll review the rework station and the essential practices that can make or break circuit reliability. Gayle will walk us through the common pitfalls she’s seen—from the dangers of unapproved fluxes to mismatched cleaning solvents—and explain how these mistakes lead to long-term failures in the field. 

She’ll also share practical advice on maintaining a contamination-free bench, the importance of selecting compatible chemistries, and why regular audits and operator education are key to preventing unintended residues and contaminants.

Gayle will help us prevent one problem, rework, while not creating another, contamination.

Gayle's Contact Information
Gayle Towell
[email protected]
https://www.aimsolder.com

On today’s episode, we’re turning our focus to a pivotal innovation that has transformed design and manufacturing processes: flexible circuits.

Flexible circuits have emerged as a game-changer in the manufacturing and design of electronic assemblies. With their unique ability to bend, twist, and conform to complex shapes, they offer unparalleled advantages in applications where space is at a premium and reliability is paramount. 
From wearable technology and medical devices to aerospace systems and consumer electronics, the use of flexible circuits has expanded rapidly, bringing with it both opportunities and challenges.
In this episode, we’ll explore the evolution of flexible circuit technology, discussing its key benefits, such as lightweight construction, enhanced durability, and improved design freedom. 

We’ll also touch on the manufacturing complexities, material considerations, and the critical role that process control plays in ensuring reliability and performance.

My guest today is Joseph Fjelstad. Joe is the founder of Verdant Electronics. Joseph Fjelstad has been active in electronics manufacturing since 1972 in various roles, including as a chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones. 
He is an internationally recognized expert, inventor and lecturer in the field of electronics interconnection technology and a veteran of several startup companies, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera (now the public company, Xperi).

Some of Joe’s innovative devices and novel reliability improving IC packaging structural features are found in nearly every electronic device made today. 

He is also an author, co-author or editor of several books on interconnection technology, including Flexible Circuit Technology 4th Edition, the most widely distributed reference book on the topic, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics — The SAFE Approach. 

In addition, Fjelstad has written hundreds of articles, columns and commentaries for various industry magazines and journals over the last five decades. And today, he’s the guest on my show.

Here is a list of Joe's books:
Flexible Circuit Technology 4th Edition
https://iconnect007.com/my-i-connect007/books/flex-circuit-technology

Chip Scale Packaging for Modern Electronics
https://www.emerald.com/insight/content/doi/10.1108/cw.2004.21730bae.001/full/html

Solderless Assembly for Electronics: The SAFE Approach
https://iconnect007.com/my-i-connect007/books/solderless-assembly-electronics-safe-approach#:~:text=SAFE%20technology%20(Solderless%20Assembly%20For,design%20efficacy%2C%20reliability%20and%20security.

Joe's Company:
Verdant Electronics
https://verdantelectronics.net 

Chapters:
00:00:00 Importance of Flexible Circuits in Modern Electronics  
00:02:42 Exploring the World of Flexible Circuits  
00:05:30 Introduction to Flexible Circuits: A Historical Perspective
00:08:43 Entrepreneurship Mindset: Naivety and Innovation
00:11:08 The Value of Naivety in Engineering  
00:13:43 Innovations in Bubble Printing Technology  
00:16:47 Understanding Flex Circuits: Applications and Challenges
00:19:58 The Lifespan and Failure of Torsion Bars  
00:22:21 Evolution of Soldier Technology: From Heads-Up Displays to Wearables
00:25:24 The Origins of the Integrated Circuit
00:28:13 Advances in Microelectronics: From Printed Transistors to Modern Tech
00:31:28 Challenges and Solutions in Flexible Circuit Design
00:34:00 Collaborative Design for Efficient Manufacturing  
00:36:49 Advances in Flexible HDI and the Upcoming Ultra HDI Conference  
00:39:46 Evolution of Flexible Circuits: From 1903 to Present   
00:42:40 Innovating Flexible Circuits  
00:45:13 Evolution of Toll Road Technology
00:48:08 The Future of Flexible and Stretchable Circuits
00:51:53 Introduction to Verdant Electronics  
00:54:46 The Military's Stance on Lead-Free Technology  
00:56:27 Innovating Solderless Technology
00:59:18 Insights on Persistence and Success in Entrepreneurship

Today, I’m in Rosemont Illinois at SMTAI, Surface Mount Technology International. I’m in the Ultra-HDI Pavilion on the trade show floor. And what are we going to talk about here in the Ultra-HDI pavilion? Ultra high density interconnects, of course.

As the demand for smaller, faster, and more powerful devices grows, the need for innovative solutions in circuit design has never been greater. UHDI's represent a significant leap forward, allowing for more connections in a smaller space, pushing the boundaries of what's possible in electronic assemblies.

But what exactly are UHDI's? Essentially, they refer to circuit boards with incredibly fine pitch interconnects, enabling higher functionality and complexity in much smaller form factors. 
This breakthrough is transforming industries like consumer electronics, aerospace, automotive, and medical devices, where space, weight, and performance are critical factors.

In this episode, we’ll explore the advantages UHDI's bring to the table, from increased design flexibility and performance to better thermal management. We'll also discuss how UHDI's are set to impact the assembly process. With tighter tolerances and more intricate layouts, UHDI assemblies will require new approaches to assembly, inspection, and reliability testing.

To better explain UHDI technology, we’ve put together a panel of subject matter experts. Tara Dunn, Director of Training and Education at the Surface Mount Technology Association (SMTA), will moderate a panel discussion with other subject matter experts.

In addition to Tara, our other experts are Anaya Vardya CEO of American Standard Circuits, Chrys Shea from Shea Engineering Services, Michael Sivigny, owner and General Manager of CeTaQ Americas, Oren Manor, Op-Center Core Program Business Director at Siemens Digital Industries Software, and Anaya Vardya from American Standard Circuits.

Ultra-HDI is here! And if you haven’t seen it on your assembly line yet, it’s coming, so stay tuned as we unpack the future of Ultra High Density Interconnects and what it means for the next generation of technology.

One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process. 

Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and performance of your assemblies is essential. 

In this episode, we’ll break down what thermal profiling is, why it’s important, and how it affects everything from solder joint integrity to component placement. 

We’ll also explore the challenges and solutions involved in getting your thermal profile just right, ensuring your circuit assemblies are built to last in a competitive and demanding industry. 
Will review thermal profiling best practices, common mistakes, and the various capabilities of thermal profilers.

I guest today is Mark Waterman. Mark is the Electronics division manager at ECD, a manufacturer of thermal profiling equipment founded in 1964. Mark began his career at ECD in 2006.
I’ll ask Mark all about thermal profiling best practices right after this.

Mark Waterman's Contact Information:
Mark Waterman
[email protected]
https://ecd.com

If you're part of the electronics landscape, you've likely encountered the role contract manufacturers play — and it's a critical one. These specialized partners bridge the gap between design innovation and full-scale production, bringing efficiency, expertise, and flexibility to the table.

As companies seek to meet growing demand for advanced electronic products, contract manufacturers are increasingly relied upon to provide cost-effective, high-quality assembly services. Whether it's managing supply chains, ensuring compliance with industry standards, or accelerating time to market, their contributions have become indispensable. In today's episode, we'll explore how contract manufacturing works, why it's so vital, and what trends are shaping the future of this essential industry.

My guest today is Adrian Leal. Adrian serves as the USA Business Development Manager for Teltonika EMS and is the President of the Houston SMTA Chapter. With over 30 years of experience in the manufacturing industry, he has worked extensively as both an end user and a service provider. Throughout his career, he has held diverse roles including process engineer, manufacturing engineer, quality engineer, field engineer, and sales engineer.

In 2003, Adrian became the first engineer from the oil and gas industry to earn the prestigious Process Engineer certification from the SMTA. From 2006 to 2015, he voluntarily took on the role of ESD Subject Matter Expert for SLB, where he developed an internal ESD program that remains in use today.

If you’re in Texas, you may know Adrian from his involvement in Cup of Joey networking events.
I’ll talk with Adrian about his transition from an OEM to a contract manufacturer and his recommendations on how to choose the most appropriate contract manufacturer for your needs.

Adrian’s contact information:
Adrian Leal
[email protected]
https://teltonika-iot-group.com

As the demand for more durable and dependable electronics continues to rise across industries, the choice of soldering materials, such as solder paste, plays a pivotal role in determining the reliability of these devices. We'll discuss how selecting the right solder paste can influence performance and longevity, and we'll hear from an industry expert about the latest advancements and best practices in soldering material technology. 

I guest today is Ebad Rehman, Regional Product Manager at MacDermid Alpha Electronics Solutions. He has a Master's degree in Technology from Illinois State University and has led multiple technical and strategic projects for MacDermid Alpha, including new product development and technology development projects, using lean and agile methodologies. He’s also planned and developed processes for the Power Electronics group and the Aftermarket Enhancement group to drive efficiencies and effectiveness. 

Whether you're a seasoned engineer or someone new to the electronic assembly industry, this episode will equip you with the knowledge to make informed decisions that enhance the reliability of your electronic assemblies. Join us as we explore the critical intersection of materials science and electronics reliability.

Ebad Rehman's Contact Info:
[email protected]
https://www.macdermidalpha.com

Two episodes ago, episode 149, we talked all about automated optical inspection. Today we're exploring the impact of less automated inspection Technology, that being optical microscopes.
From commercial, class 1 electronics to high reliability class 3 electronics, the intricate electronic devices we rely on daily are assembled with astonishing precision. This precision wouldn't be possible without the aid of advanced optical microscopes. These remarkable instruments allow technicians and engineers to inspect, analyze, and ensure the quality of electronic components down to the minutest detail.

In this episode, we'll uncover how optical microscopes have impacted electronic assembly, enhancing productivity, ensuring reliability, and driving innovation. 

One of the unique benefits microscopes provide, particularly in hand soldering applications, is the ability to view and solder the assembly under high magnification through the microscope. Obviously, this is not something any AOI system can perform.

But microscopes are not limited to soldering applications. One of the most critical applications of optical microscopes in the electronic assembly industry is the inspection of circuit assemblies for quality assurance. Circuit assemblies are the heart of many products, comprising numerous, highly miniaturized components and connections that must be flawlessly integrated. Even the smallest defect, such as a microscopic crack or an improperly soldered joint, can lead to significant malfunctions or failures.

Optical microscopes enable detailed inspection of these assemblies, allowing quality control professionals to identify and rectify issues that would be invisible to the naked eye. 
By providing high-resolution images and magnification, these microscopes help in detecting defects, ensuring correct alignment and polarity of components, and verifying the integrity of solder joints. This meticulous inspection process is crucial for maintaining the reliability and performance of electronic devices, ultimately ensuring customer satisfaction and, in many cases, safety.

We'll hear from two industry experts who will share insights on the latest technological advancements and how these tools are indispensable in maintaining the high standards of modern electronics. Nili Walp is Marketing Manager at Vision Engineering, a manufacturer of microscopes design for various industries, including the Electronics assembly industry, where she has worked for over eight years. Nili earned a bachelors in communications from Boston University.

Richard Nagel is Vice President of sales and marketing at Vision Engineering where he has worked for over 21 years. Richard and Nili will share insights on the latest technological advancements and how these tools are indispensable in maintaining the high standards of modern electronics. 

Vision Engineering Contact Information:
https://www.visioneng.us
[email protected]