Dan is joined by a panel of experts to discuss chiplets and 2.5/3D design. The panelists are: Saif Alam – Vice President of Engineering at Movellus Inc., Tony Mastroianni Siemens EDA- Advanced Packaging Solutions Director and Craig Bishop – CTO Deca Technologies.

In this spirited and informative discussion the … Read More

Dan is joined by William Ruby, director of product management for Synopsys Power Analysis products. He has extensive experience in the area of low-power IC design and design methodology, and has held senior engineering and product marketing positions with Cadence, ANSYS, Intel, and Siemens. He also has a patent in high-speed… Read More

Dan is joined by Stephen Fairbanks, CEO of Certus Semiconductor. Stephen is an ESD pioneer with over 30 years of experience starting with his time at Intel, SRF Technologies, and now Certus Semiconductor.

Stephen describes the varied challenges of ESD andI/O library design presented by today’s technologies and design… Read More

Dan is joined by Tareq Bustami, senior vice president of marketing & sales, Axiado. Tareq has more than 20 years of experience in the semiconductor and networking industries. Before joining Axiado, he led NXP’s embedded processors for the wired and wireless markets, and was in charge of growing multi-core processor solutions… Read More

Dan is joined by Chris Shrope. Chris leads high tech product marketing at Model N, a compliance leader for high-tech manufacturers. Chris has deep experience defining product market fit and related new product development activities. He received his MBA and holds certifications in Economics, Law, Product Management and Marketing.… Read More

Dan is joined by Dr. Adam Carter, CEO of OpenLight. Adam has over 25 years of experience in the semiconductor industry, including a variety of roles in Networking, Optical Communication Systems, Optical Components and Modules markets.

Adam describes OpenLight’s unique silicon photonics platform – what makes … Read More

Dan is joined by Dave Lazovsky, CEO of Celestial AI. Dave has an in-depth knowledge of semiconductor, data/telecommunications, photonics and clean energy industries, as well as extensive international business experience. He currently has over 50 issued and 5 pending U.S. patents.

In this broad and forward-looking discussion,… Read More

Dan is joined by Calista Redmond, CEO of RISC-V International. Prior to RISC-V International, Calista held a variety of roles at IBM, including Vice President of IBM Z Ecosystem where she led strategic relationships across software vendors, system integrators, business partners, developer communities, and broader engagement… Read More

Dan is joined by Jeff Wilson, the DFM director of product management for Calibre Design Solutions at Siemens EDA. Jeff is responsible for the development of products and design flows that address the challenges of DFM and increasing the robustness of designs.

Dan explores the capabilities of the new Calibre Design Enhancer product… Read More

Dan is joined by Dr. Walden Rhines to discuss the Q1 2023 Electronic Design Market Data report that was just released. SEMI and the Electronic System Design Alliance collect data from almost all of the electronic design automation companies in the world and compile it by product category and region of the world where the sales occurred.… Read More