The EMC Society Podcast: Hear Us Above the Noise

 Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community.
 
In this first episode in the new year we invited Vignesh Rajamani, EMC-S president. 
He will talk about his new years resolution and the international EMC conference highlights for 2023.

• GEMCOM Bali; Indonesia, January 19-20 : http://www.gemccon2023bali.org/
• APEMC+INCEMIC, Bangalore, Induia, May 22-25: https://apemc-incemic-2023.org/
• 2023 IEEE International EMC+SIPI Grabd Rapids, MI, USA, July 31- August 4: https://www.emc2022.emcss.org/
• EMC Europe, Krakow,Poland, September 4 -9: https://emceurope2023.org/

 Further information about the EMC Society can be found here: https://www.emcs.org/

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www.emcs.org
https://www.linkedin.com/company/ieee-emcs/

Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community.

In this special issue we speak with Mark Steffka, General Chair, 2023 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI).
He will highlight the hot-topics and share the reason to attend.

Mark you calenders: July 31 - August 4
https://emc2023.org/

Share your thoughts with us!

www.emcs.org
https://www.linkedin.com/company/ieee-emcs/

Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community.

In this issue we share insights from within the EMC Society leadership.

During the past ExCom meeting held at IEEE Headquarters in Piscataway, in the beginning of November - new Vice President candidates have been elected to serve for the EMC Society for a 2 year term, starting in January 2023.
In this episode we will introduce the newly elected VP’s. Learn more about: 

VP Standards – Karen Burnham

• EMC Standards: https://www.emcs.org/standards.html

VP Member Services – Janet O’Neil

• Become a member: https://www.emcs.org/membership.html
• Membership Brochure: https://www.emcs.org/assets/documents/IEEE_EMCS_brochure.pdf
• Resource Center: https://resourcecenter.emc.ieee.org/
• Find your local EMC chapter: https://www.emcs.org/chapters-and-chairs.html
• EMC Young Professionals: https://www.emcs.org/ieee-emc-young-professionals.html
• Awards: https://www.emcs.org/awards.html
• EMC Society History: https://www.emcs.org/history.html
• Distinguished Lecturers: https://www.emcs.org/distinguished-lecturers.html

VP Technical Services – Xiaoning Ye

• Overview of all Technical Committees (TC), Technical Advisory Committees (TAC) and Special Committees (SC): https://www.emcs.org/technical-committees.html

VP Communications – Frank Gronwald

• T-EMC - IEEE Transactions via IEEE Xplore: https://ieeexplore.ieee.org/Xplore/guesthome.jsp
• EMC Magazine: https://www.emcs.org/emc-magazine.html
• L-EMCPA –IEEE Letters on Electromagnetic Compatibility Practice and Applications: https://www.emcs.org/call-for-papers.html
• J-MMCT: - Journal in Multiscale and Multiphysics Computational Techniques: https://ieee-jmmct.org/?page_id=11
• T-SPI – Transactions on SIPI - soon to come
• EMC Society Podcast: https://ieeeemcsocietypodcast.buzzsprout.com/

VP Conferences – Frank Leferink

• 2023 IEEE EMC+SIPI:  www.emc2023.org
• IEEE Symposiua Schedule:  https://www.emcs.org/ieee-symposia-schedule.html
• EMC related conferences:  https://www.emcs.org/emc-conferences-and-symposia.html
• Local EMC Chapter Colloquium and Exhibition/ EMC Table-Top Shows: https://www.emcs.org/exhibitions-and-table-top-shows.html

Share your thoughts with us!

www.emcs.org
https://www.linkedin.com/company/ieee-emcs/

Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community.

In this issue we will talk with Lee Hill. He is founding partner of SILENT Solutions LLC, an electromagnetic compatibility (EMC) consulting firm. He is also Managing Director of Silent Solutions GmbH (Munich).

Lee will be talking about - I Have a Graduate Degree in EMC - Now What. 
Learn about the bright future and job possibilities in the field of EMC.

Share your thoughts with us!

www.emcs.org
https://www.linkedin.com/company/ieee-emcs/

Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community. 

In this issue we will talk with  DongHyun Bill Kim.
Bill is assistant professor of electrical and computer engineering at Missouri University of Science and Technology, Rolla and will talk about Inhomogeneous Dielectric Materials of PCB – Dk,Df Extraction and It’s Impact on Crosstalk.

Bio of the speaker:
DongHyun (Bill) Kim received B.S., M.S. and Ph.D. degrees in electrical engineering from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea, in 2012, 2014 and 2018, respectively. In 2018, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, MO, USA, and is currently an Assistant Professor with the Missouri S&T EMC Laboratory, Rolla, MO, USA. 

 His current research interests include nanometer-scale devices, through-silicon via (TSV) technology, dielectric material characterization and signal integrity (SI), power integrity (PI), temperature integrity (TI), electromagnetic compatibility (EMC) and electrostatic discharge (ESD) in 2.5D/3D IC systems. 

 He is a recipient of the IEEE Region 5 Outstanding Young Professional (formerly GOLD) Award, IEEE St. Louis Section Outstanding Young Engineer Award and DesignCon Best Paper Award. He is a co-recipient of the DesignCon Early Career Best Paper Awards and IEEE EMC Symposium Best SIPI Symposium Paper Award and Best SIPI Student Paper Awards. He is currently the vice chair or IEEE St. Louis Section, and the vice chair of the IEEE EMC Society TC-10 (Signal Integrity and Power Integrity).

References:

• S. Yong, V. Khilkevich, X. Cai, C. Sui, B. Sen, J. Fan, ‘A Comprehensive and Practical Way to Look at Far-End Crosstalk for Transmission Lines with Lossy Conductor and Dielectric ’, IEEE Trans-EMC
• Y. Liu, et al., " Far-End Crosstalk Analysis for Stripline with Inhomogeneous Dielectric Layers (IDL)”, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021, pp. 825-830.
• Y. Liu, S. Yong, Y. Guo, J. He, C. Li, X. Ye, J. Fan, V. Khilkevich, D. Kim, "An Empirical Modeling of Far-end Crosstalk and Insertion Loss in Microstrip Lines", conditional accepted to IEEE Transactions on Signal and Power Integrity. 
• Y. Liu, S. Yong, Y. Guo, J. He, C. Li, X. Ye, J. Fan, D. Kim, "Far-end Crosstalk Modeling and Prediction for Stripline with Inhomogeneous Dielectric Layers (IDLs) ", conditional accepted to IEEE Transactions on Signal and Power Integrity. 

Share your thoughts with us!

www.emcs.org
https://www.linkedin.com/company/ieee-emcs/

Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community. 

In this issue we will talk with  Vignesh Rajamani. The IEEE EMC society president talks about the 2022 IEEE International Symposium on EMC+SIPI held in-person in Spokane, WA.
He shows the advantages and opportunities of being involved in the EMC society.

Share your thoughts with us!

www.emcs.org
https://www.linkedin.com/company/ieee-emcs/

Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community. 

In this issue we will talk with  Gianluca Viscillo. 
Gianluca is EMC expert for space emc with OHB Italia and will talk with us about EMC in Space Systems. We will learn about current practices and future trends.

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www.emcs.org
https://www.linkedin.com/company/ieee-emcs/

Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community. 

In this issue we will talk with  Andreas Hardock. Andreas is with Nexperia as Principal Product Application Engineer for ESD and EMC. He will talk about ESD and ESD protection in automotive EMC. 

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www.emcs.org
https://www.linkedin.com/company/ieee-emcs/

Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community. 

In this special issue we will talk with Patrick DeRoy, EMC Expert with Analog Devices.
Patrick is Young Professional liason of the IEEE and the EMC-Society and he will talk about the 3 ! YP events during the International EMC+SIPI 2022 symposium.

So mark you calendars!
See you there!

 YP Events page on symposium website: https://emc2022.emcss.org/young-professionals.html

 Duffleboard video: https://vimeo.com/277027327

Share your thoughts with us!

www.emcs.org
https://www.linkedin.com/company/ieee-emcs/

Welcome to the CROSSTALK - the IEEE EMC Society Podcast. Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community. 

In this issue we will talk with Morten Sørensen, an Associate Professor, PhD at the Centre for Industrial Electronics (CIE) at the University of Southern Denmark. He will share his insights about near-field scanning and its industrial application.

Here is a link to a short demo on near-field scanning at the SUD:
 https://youtu.be/eknMOi-Ohxw

 Here is a paper on near-field scanning and simulations:

 M. Sørensen, O. Franek and G. F. Pedersen, "Recent developments in using measured sources in computational EMC," 2015 9th European Conference on Antennas and Propagation (EuCAP), 2015, pp. 1-5.

 Here is a paper on the Huygens’ box method also mentioned in the interview.

 M. Sørensen, I. B. Bonev, O. Franek and G. F. Pedersen, "Assessment of the Huygens’ Box Method With Different Sources Near Obstacles," in IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 2, pp. 433-442, April 2020, doi: 10.1109/TEMC.2019.2908354.

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