TTI Host: John Sandy 
Molex Subject Matter Expert: Logan Lukasik 

​​TTI host John Sandy visits with Molex subject matter expert Logan Lukasik about the Premo‑Flex family of flexible flat cables (FFC) and flexible printed circuits (FPC), designed to solve space, routing and reliability challenges. The episode highlights the Molex one-stop-shop advantage and design considerations to improve efficiency, performance and time to market. ​ 

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TTI Host: Gabe Osorio 
Aptiv SME: Terry George​

TTI host Gabe Osorio visits with Aptiv subject matter expert Terry George about high‑voltage interconnects and their need for customization to meet evolving vehicle architectures and power demands. They discuss how system-level design, modularity and collaboration with OEMs enable safer, more efficient electrification.

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​​​TTI Host: Kris Whitehouse 
Littelfuse SME: Henry Ung​​ 

​​TTI host Kris Whitehouse and Littelfuse subject matter expert Henry Ung examine how semiconductor reliability, durability and quality are essential in the performance of emergency medical devices, such as defibrillators. They also discuss technology trends toward smaller, faster and lower‑cost components that make life‑saving equipment more accessible.​ 

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​​TTI Host: Gabe Osorio 
TE Subject Matter Expert: Paul Reil, ICT BU​ 

TTI host Gabe Osorio and TE Connectivity subject matter expert Paul Reil discuss how advanced data connectivity is enabling safer, smarter and more rugged on‑ and off‑highway commercial vehicles in extreme environments. They explore long cable runs, harsh environments, backward compatibility and Ethernet connectors in shaping the future of transportation. 

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​​TTI Host: John Sandy 
Molex Subject Matter Expert: Michelle Reynolds​ 

TTI host John Sandy is joined by Molex subject matter expert Michelle Reynolds to discuss how industrial connectors are evolving to support the advanced application needs of data centers, robotics and automation. Key topics include miniaturization, push-pull technology and the shift toward faster, more reliable connections. 

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​​​TTI Host: Gabe Osorio 
Aptiv SME: John Pechatsko​​ 

​​TTI host Gabe Osorio and Aptiv subject matter expert John Pechatsko discuss EV charging inlets, the critical but often overlooked components that test the limits for charging speed, safety, reliability and user experience. They also explore how thermal management, modular design and standardization are shaping the future of EV fast charging.​ 

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TTI Host: Gabe Osorio 
TE Subject Matter Expert: Vasanth Sista, Automotive BU 

TTI host Gabe Osorio and TE Connectivity subject matter expert Vasanth Sista explore how ADAS, infotainment and electrification are driving unprecedented data demands in vehicles. They break down key challenges like signal integrity, EMI, harsh environments and evolving architectures and explain why end-to-end connectivity design is critical for safe, reliable performance. 

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TTI host Brian Wellhouse and Littelfuse subject matter expert Marco Doms discuss TMR sensing for connected health, including trends, challenges, and solutions.

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TTI Host: John Sandy 
Molex Subject Matter Expert: Brad Schoester 

TTI host John Sandy is joined by Molex subject matter expert Brad Schoester to explore how products like solderless terminals and DIN rail terminal blocks are evolving through growing electrification, data center and automation demands. The results are more robust, easy-to-use designs that integrate tooling systems for increasingly reliable and scalable solutions. 

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​​TTI Host: Gabe Osorio 
Aptiv SME: Don Bizon​ 

​​TTI host Gabe Osorio sits down with Aptiv subject matter expert Don Bizon to discuss high-voltage (HV) market trends in the transportation industry, from the rise of full HV architectures to fast-charging demands and thermal challenges. They also explore innovations extending beyond transportation into battery energy storage, data centers and other high-power markets.​ 

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