Ron Demcko - Senior Fellow at KYOCERA AVX Components Corporation 
Graeme Dorkings – Vice President Supplier Engagement & Engineering 

​​TTI host Graeme Dorkings and KYOCERA AVX subject matter expert Ron Demcko discuss how capacitors are used ​in wind, solar and other energy systems to handle high power levels. They explain how the right ​components help keep systems safe, reliable and efficient as more energy is generated and delivered.​ 

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Ron Demcko - Senior Fellow at KYOCERA AVX Components Corporation 
Graeme Dorkings – Vice President Supplier Engagement & Engineering

TTI host Graeme Dorkings sits down with KYOCERA AVX subject matter expert Ron Demcko to discuss how capacitors support low-power systems by providing backup energy, replacing batteries and enabling reliable operation. They share real-world examples from areas like IoT devices, sensors and robotics, where reliable, low-maintenance power is essential. 

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Hosts:

Ron Demcko - Senior Fellow at KYOCERA AVX Components Corporation 
Graeme Dorkings – Vice President Supplier Engagement & Engineering 

TTI host Graeme Dorkings and KAVX subject matter expert Ron Demcko discuss how advanced processors and high-power systems are reshaping capacitor selection and power distribution design. They explore how the right capacitor choices help keep systems dependable and efficient as power demands continue to increase. 

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​​​TTI Host: Kris Whitehouse 
Littelfuse SME: Henry Ung​​ 

​​TTI host Kris Whitehouse and Littelfuse subject matter expert Henry Ung examine how semiconductor reliability, durability and quality are essential in the performance of emergency medical devices, such as defibrillators. They also discuss technology trends toward smaller, faster and lower‑cost components that make life‑saving equipment more accessible.​

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​​TTI Host: Kris Whitehouse 
Littelfuse SME: Barry Brents 

​​TTI host Kris Whitehouse visits with Littelfuse subject matter expert Barry Brents about the importance of circuit protection in medical devices, where reliability, patient safety and high performance are critical. These components are essential in safeguarding against overcurrent, static discharge and power faults.​

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​​TTI Host: Gabe Osorio 
TE Subject Matter Expert: Shane Lauth, Performance Materials BU​ 

TTI host Gabe Osorio sits down with TE Connectivity subject matter expert Shane Lauth to explore the critical role protection plays in next‑generation automotive and commercial vehicle technologies. The discussion also highlights how early design decisions in shielding, insulation and sealing are key to reliability in increasingly complex, high‑voltage, data‑dense systems. 

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TTI Host: John Sandy 
Molex Subject Matter Expert: Logan Lukasik 

​​TTI host John Sandy visits with Molex subject matter expert Logan Lukasik about the Premo‑Flex family of flexible flat cables (FFC) and flexible printed circuits (FPC), designed to solve space, routing and reliability challenges. The episode highlights the Molex one-stop-shop advantage and design considerations to improve efficiency, performance and time to market. ​ 

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TTI Host: Gabe Osorio 
Aptiv SME: Terry George​

TTI host Gabe Osorio visits with Aptiv subject matter expert Terry George about high‑voltage interconnects and their need for customization to meet evolving vehicle architectures and power demands. They discuss how system-level design, modularity and collaboration with OEMs enable safer, more efficient electrification.

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​​TTI Host: Gabe Osorio 
TE Subject Matter Expert: Paul Reil, ICT BU​ 

TTI host Gabe Osorio and TE Connectivity subject matter expert Paul Reil discuss how advanced data connectivity is enabling safer, smarter and more rugged on‑ and off‑highway commercial vehicles in extreme environments. They explore long cable runs, harsh environments, backward compatibility and Ethernet connectors in shaping the future of transportation. 

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​​TTI Host: John Sandy 
Molex Subject Matter Expert: Michelle Reynolds​ 

TTI host John Sandy is joined by Molex subject matter expert Michelle Reynolds to discuss how industrial connectors are evolving to support the advanced application needs of data centers, robotics and automation. Key topics include miniaturization, push-pull technology and the shift toward faster, more reliable connections. 

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