In most cases, it’s very expensive to get game-changing technological advancements in electrical components to the market. This is because they also require the advancement of the existing design workflows and tools. This barrier has slowed down and even completely stopped the possible mass production of many revolutionary devices. 3D IC is not exempt from this challenge - that’s why several large companies have invested heavily in the development of new package design flows and tools to handle it.

In this episode, John McMillan interviews Anthony Mastroianni, the 3D IC Solutions Architect Director at Siemens Digital Industries Software. He has been in the semiconductor industry for over 30 years, primarily in the design of custom integrated circuits. He will help us understand the necessary design flow changes needed to make 3D IC a reality.

In this episode, you will learn about the differences between traditional semiconductor packaging and 3D IC packaging. You will also hear about the design workflow required to successfully build 3D IC-based devices. Additionally, you will hear about the new tools that are required to successfully create and test such devices.

What You Will Learn in this Episode:

Connect with Anthony Mastroianni: 

• LinkedIn

Connect with John McMillan: 

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Standardization plays an important role in promoting the mass adoption of new electrical components. For instance, Application-Specific Standard products, known as ASSP components have been broadly adopted by system designers for board-level integration. These devices have standardized models to enable the PCB level, system design ecosystem. Chiplets are an analogous component that can be integrated at the package level. That’s why the 3D IC design community will likely advocate for standardized models to be adopted by prospective chiplet vendors.

In this episode, John McMillan interviews Anthony Mastroianni, the 3D IC Solutions Architect Director at Siemens Digital Industries Software. He is also a member of the Chiplet Design Exchange, whose charter is to standardize chiplet models and deliverables. He will help us understand the application of 3D IC and the need for standard chiplet models.

In this episode, you will find out how the 3D IC technology is being utilized and the impact it is having. We will also discuss what the future holds for this new methodology and the steps that need to be made to drive its adoption. Lastly, you will learn about the progress being made in standardizing chiplet models and the need for defined workflows to facilitate a chiplet ecosystem.

What You’ll Learn in this Episode:

Connect with Anthony Mastroianni: 

• LinkedIn

Connect with John McMillan: 

• LinkedIn

Hosted on Acast. See acast.com/privacy for more information.

Electronic circuits design has become more complex due to the consumers’ need for more features that require more processing capability. To keep up with these demands, new methodologies of designing and connecting chips have been developed. The latest innovation in this area is the three-dimensional integrated circuits (3D IC), which take less space and deliver much higher performance compared to traditional monolithic technologies.

In this episode, John McMillan interviews Anthony Mastroianni, the 3D IC Solutions Architect Director at Siemens Digital Industries Software. He has been in the semiconductor industry for over 30 years, primarily in the design of custom integrated circuits. He’ll help us understand the 3D IC technology and the impact it’s expected to have.

In this episode, you’ll learn about the current chip standards in the industry and where they fall short. You’ll also learn how 3D IC works and how it will help in solving most of the challenges facing today’s chips. Additionally, you’ll hear about the challenges that come with 3D IC and how some of them are being resolved.

What You’ll Learn in this Episode:

Connect with Anthony Mastroianni: 

• LinkedIn

Hosted on Acast. See acast.com/privacy for more information.