Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, machine learning, and quantum technologies.

Dariush and Rose share their wealth of knowledge on material characterization, modeling, and application engineering, and discuss how Henkel maintains its pivotal role within the semiconductor ecosystem. From underfills to thermal interface materials, discover how comprehensive material offerings are shaping the future of high-performance computing.

Explore the fascinating advancements in material modeling for semiconductors, where physics-based simulations are transforming reliability testing and development cycles.

Gain a clearer understanding of capillary underfill materials and their vital role in enhancing solder joint reliability under thermal stress.

This episode delves into the collaboration between material developers and modeling experts, underscoring the importance of early customer engagement to tailor innovative solutions.

If you are interested in learning how cutting-edge materials are propelling the semiconductor industry forward, this conversation is a must-listen.

Contact the Speakers on LinkedIn
Dariush Tari, Henkel Semiconductor Packaging Materials
Rose Guino, Semiconductor Packaging Materials 

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This episode was recorded live at SEMICON Europa.

Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies.  They discuss the transition from 2D to 3D measurements in semiconductor manufacturing.  Zahn explains why  non-destructive, optical 3D measurements offer precise height and position data with sub-micron resolution.

You'll learn how these measurements are crucial for early defect detection, improving efficiency, and reducing waste. You'll also gain an understanding about the importance of real-time, in-line measurements for quality assurance and process optimization.

Zahn also highlights Koh Young's AI integration for process control and the future potential of sub-micron resolution systems.

Contact Michael Zahn on LinkedIn

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This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab.  It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS.

SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry.

James McGrath from KLA discussed his role as a PE CBD Process Engineer and his unexpected entry into the semiconductor industry.

Augustin Detruit from ERS Electronics highlighted his growth from a master's thesis to Head of Production, overseeing a significant increase in production capacity.

Luca Sinkó from Semilab shared her journey from physics to R&D Team Leader and her recent promotion to Product Manager.

Charis Kalantzi from Cadence detailed her role in supporting digital design tools and her involvement in community volunteering.

All four talk about what brought them into the semiconductor industry, what made them stand out to the judges, and the honor of receiving such an award.

From Dionys van de Ven, we hear about the announced the launch of Comet Yxlon's new 3D X-ray system for fab-level yield improvement,

Peter Dijkstra from Trymax, discussed what is driving the company's growth and it's expansion into the U.S. market.

Spencer Wall talks about DSV's acquisition of Schenker, and shares the progress so far. Michael Murray talks about DSV-IMS foray into using AI and machine learning to improve supply chain efficiencies. 

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In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal. 

John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry. He highlighted how smart software can increase factory productivity by 5-15% by making autonomous decisions based on digital twins. You’ll learn about Behnke’s vision for the Smart Control Room. 

Catherine Le Lan, Synopsys, emphasized the need for collaboration between academia and industry to address the talent shortage, suggesting cross-disciplinary education and early branding of microelectronics. 

Katharina Westrich, Siemens, explained how digital twins optimize factory planning, reduce emissions, and train workforce remotely, envisioning a future where virtual and real-world operations are seamlessly integrated. 

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This episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going to be tricky, for sure.

Frederic Godemel of Schneider Electric talks about what he calls the “energy trilemma” that is causing the energy supply challenges. These are security, affordability, and the impact on the planet. He explains how electricity generated from renewable sources will help address these issues and implores the industry to focus on growing responsibly so it can meet its goals. 

The conversation continues with Comet CEO, Stephan Haferl, who discusses the importance of developing power-efficient semiconductors. He talks about the power advantages of 3D stacking and heterogeneous integration and explains how 3D X-ray technologies helps bring these technologies to market. 

 Lastly, you’ll hear from Bart Placklé of imec, who talked about next generation vehicle architectures enabled by sensing and chiplets. You’ll learn what’s driving the need for chiplets in today’s software-defined vehicles, and how chiplet architectures can take us to the next level of autonomous vehicles.

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It's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress. 

First up is Dan Berger,  National Advanced Packaging Manufacturing Program (NAPMP), who explains how CHIPS Acts monies are being used to address gaps like advanced packaging and substrate manufacturing, to help revitalize the US semiconductor industry. The focus is on developing domestic manufacturing teams for U.S. leadership in microelectronics, with global collaboration and security in mind. He discusses the importance of advanced packaging roadmaps aimed at scaling down feature sizes, eliminating interposers and integrating chiplets directly onto substrates.  

Next, we hear from the Honoroable Laurie Locascio, Director of NIST, and Undersecretary of Commerce for Standards and Technology. She explains importance of public-private collaboration, addressing research gaps, strategic investments, and global collaboration to ensure the industry's success and address economic and national security concerns.

Lastly, Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration.

 Contact the Panelists on LinkedIn

• Dan Berger, Associate Director, NAPMP
• Dr. Laurie Locascio, NIST
• Dev Palmer, NAPMP

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On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies for both organic and glass substrates. These include 3D InCites Members: LPKF Laser & Electronics, Evatec, MKS-Atotech and Lam Research; as well as Resonac, Corning, and others.

This episode starts off with a conversation with Onto Innovation CEO, Mike Plisinski, who explains how PACE came to be, its business model, and why AI is driving growth in panel-level packaging.

The story continues with a tour of PACE conducted by Keith Best, Director of PACE.  Best gives a step-by-step description of the processes as panels move from the photoresist coater, to the lithography stepper, to the developer, and then to the inspection system. He also talks about the role advanced lithography tools play in developing down-stream panel level processes. 

Lastly, you'll hear from PACE collaboration partners:

• Ralph Zoberbier, CMO, Evatec
• Kuldip Johal, MKS-Atotech
• Kazuyuki Mitsukura, Resonac
• Junro Yoon, Corning Advanced Optics
• Richard Noack, LPKF Laser & Electronics 

Read the full story on 3D InCites

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For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors. 
She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized.  It involves sourcing dies and chiplets from traditional foundries and applying semiconductor foundry processes and advanced packaging and assembly technologies. 

You'll learn:

• What's driving the transition to advanced packaging from traditional scaling
• Why the traditional foundry model may not be the way going forward
• How Foundry 2.0 is different 

Françoise also takes you on an audio tour of the facility, led by Operations Director, Carl Petteway. It gets a bit noisy - but you'll feel like you're right there, and you'll learn about the tools used to perform processes like chemical mechanical polishing (CMP), photolithography, hybrid bonding, and through silicon vias.

Contact Our Guests on LinkedIn:

• Bob Patti, CEO and Founder, NHanced Semiconductors
• Carl Petteway, Operations Director, NHanced Semiconductors

Learn More:
Read the story and see the photos from the tour on the 3D InCites Website.

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Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies. 

Brendan Wells, Amkor Technology, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses how chiplet integration is impacting the assembly processes. 

 Evan Griffith and Sze Pe Lim, Indium Corporation, talk about how changing advanced packaging requirements for AI chip sets are changing the game for materials development.  

John Lannon, general manager of Micross AIT talks about progress with the company’s 300mm capacity expansion and what it means to win the William T. Ashman and John A. Wagnon Technical Achievement Award.  

LPKF’s Richard Noack talks about the difference between glass interposers and glass core technology, and what’s driving development of these materials.

Sally Ann Henry, ACM Research, talks about the company’s decision to invest in equipment platforms to support panel level packaging.

Casey Krawiec, StratEdge Corporation, talks about what it means to receive the IMAPS Society Award for Corporate Sponsorship, and why he thinks it’s important to support these activities.

Habib Hichri, Ajinomoto Fine Techno, talks about his work with IMAPS Academy, and Ajinomoto’s new developments beyond ABF dielectric film to address advanced packaging substrate material needs.

Adeia’s Guilian Gao talks about what OSATS need to do to support die to wafer hybrid bonding processes.

Scott Sikorski, IBM, explains how the Northeast Corridor from New York up into Canada is becoming one of the U.S.’s hot spots in advanced packaging.

Peter Cronin, MRSI Micronic, introduces the company’s latest die bonders system, and talks about a new application center in Livermore CA to support its West Coast clients. 

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At IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to receive one, as it means many members have noticed their efforts. 

In this episode, Françoise sits down with three of the award winners to talk about their IMAPS experience, at different stages of their careers.

Emma P Pawliczak was awarded the Steve Adamson Student Award. She is currently getting her Ph.D. at Binghampton University. 

Brandon Hamilton won the Emerging Leader Award, is a program manager at BAE Systems in Cedar Rapids Iowa

Dr. Phil Garrou won the Lifetime Achievement Award. He is an Advanced Packaging subject matter expert for DARPA and the DoD through his consulting company Microelectronic Consultants of NC (MCNC).  

• You’ll learn about the history of IMAPS and its origins from Phil
• You’ll learn how Emma benefits from student opportunities at IMAPS
• You’ll learn about how IMAPS helped Brandon make connections in the industry
• All three talk about mentorship opportunities and how IMAPS provides a supportive community throughout a microelectronics career. 

Contact the Speakers on LinkedIn:

• Dr. Phil Garrou, MCNC
• Emma Pawliczak, Binghamton University 
• Brandon Hamilton, BAE Systems

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