Chris first learned of Aedan from his 2022 Hackaday talk about building an AR systemAR is “Augmented Reality”, but that term is different depending on the company / headset (think “magic leap” vs “google glass”)Got into AR because of robotics, he had be doing software around SLAM and CVInteracting with objects in 3D spaceThe first board he was working with was the Jetson TK1Magic Leap’s “Lightpack” had a Tegra in itApple’s new Vision Pro is more like VR with passthrough (and creepy eyes!)Being able to wear an AR unit all dayResolution mattersWhat is it worth spending power on in a headset?The previous rev used the AllWinner D1 RISCV and can support one cameraWhich way should you point a camera on a pair of glasses?MIPI DSI outputs and DSP processingLots of SIPs available for high density designsOctavo makes SIPs out of other companies’ silicon.Jason and Robert from BeagleBoard talked about Octavo when they were on the showECX337 from Sony needs 10VTorex power modules helped save space too by being stacked on top of the inductorSony uses LVDS (FPDlink) and not MIPIOffloaded processing to a phone or computerPowerWi-Fi vs bluetoothNew goal is to minimize power during processing, now it’ll be efficiency around WiFi and DisplayWith OLEDs you can selectively turn on pixelsGoal for the battery is 8 hours for “all day”What is Aedan’s “requirements space” and what’s driving it?Cost has become a concern for new boardsUsing an assembly house to have one known-good assembly boardWhat’s on the new board?The new display has MIPI DSIThe display doesn’t support 2 lane DSI out of the boxDisplays are sometimes configurable in terms of how many lanes with registersWhat do the lanes refer to? Each pair (“Data lane”) is a differential pairMost displays will do 4 lanes (8 conductors) at 1Gbps“Giganibbles per second”Silicon backplane with OLED on topViewTrixThe processor is the NXP iMX RT500“This is design is made for Garmin”Aedan is coding it in ZephyrDrivers are in MCUexpressoDCnano display driver in Zephyrno GPU driver in Zephyr2D GPU in the chipWiFi module is the same as the past rev, the Si Labs WFM200SSending compressed data over the WiFi linkMechanicalTweaking displays and 3D printed mountsPrismFlex cablesXReal / NRealUsing your brain as the combinerZach from VoidstarAedan just went to the Augmented World Expo in May. “No one was wearing an AR display around the conference”Vision for the futureFollow Aedan onlineGitHubTwitter
View all episodes
