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Abstracts: Heat Transfer and Deep Learning with Hongxia Hao and Bing Lv
Silicon has long borne the burden of heat transfer in electronics, but in a post-Moore’s Law world, researchers like Hongxia Hao and Bing Lv are using AI to discover and design next-generation materials that exceed the limits of silicon’s thermal conductivity.
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By Researchers across the Microsoft research community
4.8
8080 ratings
Silicon has long borne the burden of heat transfer in electronics, but in a post-Moore’s Law world, researchers like Hongxia Hao and Bing Lv are using AI to discover and design next-generation materials that exceed the limits of silicon’s thermal conductivity.
Read the paper
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